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Earphone support fitting line

A headphone bracket and bonding wire technology, which is applied in earphone/headphone accessories, headphone manufacturing/assembly, loudspeaker, etc., can solve the problems of low production efficiency, complicated operation steps, unsatisfactory assembly effect, etc., to achieve the degree of fit High, ensure the accuracy requirements, the effect of improving work efficiency

Inactive Publication Date: 2021-09-28
深圳双十科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, earphones are still mainly assembled by hand. The positioning of manual operation is not accurate enough, the assembly effect is not ideal, and the operation steps are complicated and the production efficiency is low.

Method used

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  • Earphone support fitting line
  • Earphone support fitting line
  • Earphone support fitting line

Examples

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Embodiment Construction

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, a clear and complete description will be made below in conjunction with the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, and Not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] A kind of earphone support fitting wire of preferred embodiment of the present invention, such as Figure 1-5 As shown, it includes a workbench 1; the workbench 1 is provided with an earphone holder jig 3 for placing the bracket 2; Laminating mechanism A 200 on the front of bracket 2, turning mechanism 300 that drives earphone bracket jig 3 to the reverse side, bonding mechanism B 400 and...

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Abstract

The invention relates to an earphone support fitting line. The earphone support fitting line comprises a workbench; an earphone support jig for placing a support is arranged on the workbench; the workbench is further sequentially provided with a feeding mechanism used for placing an earphone support jig, an attaching mechanism A used for attaching an auxiliary material A to the front face of the support, a turnover mechanism used for turning over the earphone support jig to the back face, an attaching mechanism B used for attaching an auxiliary material B to the back face of the support and a discharging mechanism; the earphone support jig comprises a jig plate; a plurality of locking assemblies for clamping the support and connecting pieces for preventing the locking assemblies from falling off are arranged on the jig plate; the feeding mechanism is further provided with an unlocking air cylinder for unlocking the locking assemblies. The upper and lower surfaces of the support are automatically pasted, the pasting degree is high, the automation degree and the working efficiency are greatly improved, manual processing is not involved in the production process, and the precision requirement of a product is further guaranteed.

Description

technical field [0001] The invention relates to the technical field of assembly of earphone auxiliary materials, and more specifically relates to an earphone bracket bonding wire. Background technique [0002] At present, auxiliary materials such as dust-proof net and double-sided tape need to be installed during the earphone assembly process. The dust-proof net can prevent external dust particles from entering the earphone, while the double-sided tape can be used for fixing, and at the same time play a certain role in sealing and supporting. At present, earphones are still mainly assembled by hand. The positioning of manual operation is not accurate enough, the assembly effect is not ideal, and the operation steps are complicated and the production efficiency is low. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an earphone bracket bonding wire for the above-mentioned defects of the prior art. [0004] The te...

Claims

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Application Information

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IPC IPC(8): H04R31/00H04R1/10
CPCH04R31/00H04R1/1058H04R2201/10
Inventor 王仕初刘涛黄建明
Owner 深圳双十科技股份有限公司
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