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Guide stretching device for producing bonding copper wire and application method thereof

A technology for bonding copper wires and stretching devices, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as the inability to accurately control the diameter of copper wires, and the breaking of copper wires, so as to avoid unsatisfactory stretching Qualified or the effect of the copper wire being pinched off

Active Publication Date: 2021-07-27
SHENZHEN ZHONGBAO NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a kind of guiding material stretching device that produces bonded copper wire, to solve the above-mentioned background technology that the diameter of the copper wire cannot be accurately controlled in the prior art, and it is easy to The problem that the copper wire is broken due to excessive tension

Method used

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  • Guide stretching device for producing bonding copper wire and application method thereof
  • Guide stretching device for producing bonding copper wire and application method thereof
  • Guide stretching device for producing bonding copper wire and application method thereof

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The specific embodiments described here are only used to explain the present invention, not to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] The present invention provides such as Figure 1-5 A material guide stretching device for producing bonded copper wire shown includes a base 1 and a stretching roller assembly 2 and a winding assembly 3 installed on the base 1, and is characterized in that: the stretching roller assembly 2 is set There is a guide assembly 4, and a...

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PUM

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Abstract

The invention discloses a guide stretching device for producing a bonding copper wire. The device comprises a base, and a stretching roller assembly and a rolling assembly mounted on the base. The stretching roller assembly is provided with a guiding assembly, an electric push rod is fixedly mounted at the upper end of the base right below the stretching roller assembly, a top plate matched with the stretching roller assembly is fixedly mounted at one end of a piston rod of the electric push rod, a concave top plate opened in a single surface is arranged on the top plate, a slot is formed in the side wall of the top plate, and a leaning assembly for adjusting the stretching diameter of a copper wire is slidably inserted into the slot. By way of matching the stretching roller assembly and the leaning assembly, the diameter of the bonding copper wire after stretching can be controlled precisely. Two ends of the stretching roller body are fixedly inserted into inner rings of a damping bearing respectively. During stretching, when a tensile force is too large, the stretching roller will rotate therealong, such that the bonding copper wire is broken.

Description

technical field [0001] The invention belongs to the technical field of mechanical equipment, and in particular relates to a material guide stretching device for producing bonded copper wires; the invention also relates to a method for using the guide material stretching device for producing bonded copper wires. Background technique [0002] Bonding copper wire is mainly used in integrated circuits and semiconductor discrete devices. It is one of the most important components in integrated circuits and semiconductor discrete devices. In the production process of bonding copper wires, stretching is an extremely important process. , the current technology is to place the bond on the placement roller at the same time, and then draw one end of the copper wire through multiple sets of guide rollers and tension rollers in turn and then fix it on the winding roller for stretching processing, but the current technology cannot Accurately control the diameter of the copper wire, and it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21C1/02B21C47/04B21C47/24H01L21/48H01L21/68
CPCB21C1/02B21C47/04B21C47/24H01L21/4896H01L21/68
Inventor 李盛伟王元钊李蓝屏李妍琼邱敏雄
Owner SHENZHEN ZHONGBAO NEW MATERIAL TECH CO LTD
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