Semiconductor wafer slicing auxiliary device capable of avoiding uneven thickness during slicing

Abstract

The invention relates to the technical field of semiconductor processing equipment, and discloses a semiconductor wafer slicing auxiliary device capable of avoiding uneven thickness during slicing. The semiconductor wafer slicing auxiliary device comprises a support, wherein a mounting column is fixedly mounted on the inner wall of the support, a slide way is fixedly mounted at one end, far away from the support, of the mounting column, and a slide rack is slidably connected in the slide way. According to the semiconductor wafer slicing auxiliary device capable of avoiding uneven thickness during slicing, a driving gear and a sliding rack are driven by a half gear to rotate and move in a reciprocating mode, automatic cutting and lifting of a blade are achieved, meanwhile, a sliding block on the outer side of a threaded rod is driven by a driven gear to move rightwards, equidistant adjustment of wafers is achieved, such that he wafer slicing thickness is more uniform, manual adjustment is not needed, more time and labor are saved, control through a PLC system is not needed, the machining cost is lower, maintenance is more convenient when faults occur, and the working efficiency of equipment is improved to a certain degree.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing equipment, in particular to an auxiliary device for slicing semiconductor wafers that avoids uneven thickness during slicing. Background technique [0002] Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. No matter from the perspective of technology or economic development, the importance of semiconductors is huge. Wafers are one of the main materials for semiconductor processing, and the quality of wafers directly affects the performance of semiconductors. [0003] The main processing method of wafers is sheet processing. For the processing of semiconductors with the same specification in the same batch, wafers of the same thickness may be required. Traditional mechanical processing may cause une...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an auxiliary device for semiconductor wafer slicing that avoids uneven thickness during slicing, which has the advantages of uniform slicing thickness, time-saving, labor-saving, low cost, and convenient maintenance, and solves the problem of uneven slicing thickness. Uniformity, time-consuming and laborious, high cost, and inconvenient maintenance

Images