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A kind of high-efficiency transfer device for smt placement line and using method thereof

A transfer device and mounting technology, which is applied in the direction of assembling printed circuits, printed circuits, electrical components, etc., can solve the problems of reducing work efficiency and achieve a perfect overall structure, good transplanting effect, and high stability. Effect

Active Publication Date: 2022-04-12
苏州万旭电子元件有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-efficiency transfer device for an SMT placement line and its use method, to solve the problem that the existing SMT placement line proposed in the above-mentioned background technology needs to rely on manpower to transfer products during the work process, reducing the work efficiency problem

Method used

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  • A kind of high-efficiency transfer device for smt placement line and using method thereof
  • A kind of high-efficiency transfer device for smt placement line and using method thereof
  • A kind of high-efficiency transfer device for smt placement line and using method thereof

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them.

[0030] see Figure 1-5 , an embodiment provided by the present invention: a high-efficiency transfer device for SMT placement lines, including a transfer device 1, a motor 2 is installed on one side of the transfer device 1, and both sides below the transfer device 1 are installed There are support legs 12, and an adjustment seat 13 is installed under the support legs 12, which is convenient for adjusting the height of the work. A chute 3 is arranged at the middle position inside the front end of the transfer device 1, and a screw rod 4 is installed inside the chute 3. The outside of the bar 4 is equipped with a slider 16, the front end of the slider 16...

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Abstract

The invention discloses a high-efficiency transfer device for an SMT mounting line and a use method thereof, and relates to the technical field of the SMT mounting line. The problem of work efficiency. Support legs are installed on both sides below the transfer device, an adjustment seat is installed under the support legs, a motor is installed on one side of the transfer device, and a middle position inside the front end of the transfer device is set There is a chute, the inside of the chute is equipped with a screw rod, the outside of the screw rod is equipped with a slider, the front end of the slider is installed with a transfer installation plate, and the middle position of the front end of the transfer installation plate is A rotating shaft is installed, and fan-shaped clamping blocks are installed on one side outside the two ends of the rotating shaft, and a fixed block is installed on the outside of the rotating shaft.

Description

technical field [0001] The invention relates to the technical field of SMT placement lines, in particular to a high-efficiency transfer device for SMT placement lines and a use method thereof. Background technique [0002] SMT patch refers to the abbreviation of a series of process processes processed on the basis of PCB. PCB is a printed circuit board; SMT is surface assembly technology (surface mount technology), which is the most popular technology and process in the electronic assembly industry. ; Electronic circuit surface assembly technology, known as surface mount or surface mount technology; it is a method of mounting non-lead or short-lead surface assembly components (SMC / SMD for short, Chinese called chip components) on printed circuit boards On the surface of the substrate or the surface of other substrates, the circuit assembly technology is soldered and assembled by reflow soldering or dip soldering; in general, the electronic products we use are composed of pcb...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04H05K3/30
CPCH05K13/046H05K3/303
Inventor 王铁成张紫滈刘泗江
Owner 苏州万旭电子元件有限公司
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