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led chip, led chip packaging module and display device

A technology of LED chip and mesa structure, which is applied to the use of semiconductor devices, electrical components, and semiconductor lamps, etc., can solve reliability problems and other problems, and achieve the effects of improving reliability, preventing chip leakage, and improving reliability performance

Active Publication Date: 2022-06-17
XIAMEN SANAN OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, one of the problems encountered in the development of LED chips in the direction of miniaturization is the reliability problem, that is, the industry is faced with the need to optimize the corresponding LED chip structure to improve product reliability.

Method used

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  • led chip, led chip packaging module and display device
  • led chip, led chip packaging module and display device
  • led chip, led chip packaging module and display device

Examples

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Embodiment Construction

[0065] The present invention provides a new LED chip, an LED chip packaging module and a display device. For a clearer representation, the present invention will be described in detail below with reference to the accompanying drawings.

[0066] This manual adopts simplified notation for each structure, except Figure 12 and Figure 14 , the same structure is marked only once in both section and top-view projection, so as to show the structure more clearly.

[0067] An LED chip according to an embodiment of the present invention, please refer to Figure 1 to Figure 14 ,in Figure 14 It is a schematic top-view projection diagram of each structure of the entire LED chip, and shows a solid line perspective structure schematic diagram, that is, each structure is displayed in a superimposed solid line.

[0068] like Figure 1 to Figure 14 As shown, the LED chip includes a substrate 100, a first mesa structure 111, a second mesa structure 112, and a current blocking block 130 (re...

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Abstract

LED chip, LED chip packaging module and display device. The LED chip includes: a substrate, a first mesa structure, and a second mesa structure; at least one bridging current blocking block; a bridging conductive block, the number of the bridging conductive blocks is the same as The number is the same; the first conductive pad and the second conductive pad; the top view projection of the bridging current blocking block has a head and the tail; the top view projection of the bridging conductive block has a first contact portion, a junction portion and a second a contact portion; the knot falls within the head, the first contact falls within the tail; the portion of the head that does not overlap the knot has a first width, and the tail does not overlap with the tail The overlapping portion of the first contact portion has a second width, and the first width is greater than the second width. The reliability of the LED chip is improved.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to an LED chip, an LED chip packaging module and a display device. Background technique [0002] LED (Light Emitting Diode) has the advantages of low cost, high light efficiency, energy saving and environmental protection, etc., and is widely used in lighting, visible light communication and light-emitting display and other scenarios. [0003] One of the development directions of LEDs is the development of miniaturization and miniaturization. After the LEDs are miniaturized, they form arrays with millimeter-level or even micrometer-level pitches, which can achieve ultra-high resolution and can be widely used in information display and other fields. Compared with liquid crystal displays (LCDs) and organic light-emitting displays (OLEDs), LEDs have the advantages of long luminous life, high brightness, thin volume, low power consumption, and high pixel density. Display is one of the representativ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/14H01L33/20H01L33/22H01L33/46H01L33/62H01L25/075
CPCH01L33/22H01L33/20H01L33/145H01L33/46H01L33/62H01L25/0753Y02B20/30
Inventor 刘士伟徐瑾刘可王水杰张中英曾合加
Owner XIAMEN SANAN OPTOELECTRONICS CO LTD
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