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Universal die cutting machining process for solving hole waste discharge

A processing technology, die-cutting technology, applied in the direction of metal processing, etc., can solve the problems of high production cost, high non-discharge rate of waste film, and incomplete waste discharge, etc., to achieve good waste discharge effect, good versatility, and high-quality products good yield

Inactive Publication Date: 2021-03-02
SUZHOU ANJIE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing products with more holes after die-cutting by a roller knife generally discharge the holes on the surface of the die-cut product through the thimble waste removal process. In actual use, the thimble waste needs to be carried out independently according to each mold production, and the waste cannot be completely discharged during waste discharge, resulting in a high non-discharge rate of product waste film, resulting in a defective rate of 20% to 50% of subsequent products, that is, the existing empty waste discharge process of die-cut products is less than High production cost and poor waste discharge effect

Method used

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  • Universal die cutting machining process for solving hole waste discharge

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Embodiment Construction

[0013] A general die-cutting process for solving hole waste, see figure 1 : It includes a roller knife 1 for die-cutting, a conveying track 2 for conveying products, an adsorption device 3 is arranged behind the conveying track 2 corresponding to the product conveying of the roller knife 1, and the die-cutting of the product toward the adsorption device 3 The removal surface is provided with a waste suction tank 4, and the inlet of the inner cavity 5 of the adsorption device 3 is connected to the waste suction tank 4, and the adsorption device 3 also includes a suction device 6, which is connected to the inner cavity 5, and the suction device 6 sucks the product The waste on the surface is adsorbed and then discharged.

[0014] The waste suction device 3 includes a fixed drum 7, a suction pipe 8, and a suction device 6. The die-cutting removal surface of the fixed drum 7 facing the product is provided with a waste suction groove 4, and the length surface of the waste suction g...

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PUM

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Abstract

The invention provides a universal die cutting machining process for solving hole waste discharge. The process is good in universality, good in waste discharge effect and capable of ensuring a good product yield. A roller cutter used for die cutting and a conveying rail used for conveying products are included, an adsorption device is arranged at the position, corresponding to the product conveying direction of the roller cutter, behind the conveying rail, a waste suction groove is formed at the position, facing the product die cutting removal face, of the adsorption device, and an inlet of aninner cavity of the adsorption device communicates with the waste suction groove. The adsorption device further comprises an air suction device, the air suction device is communicated with an inner cavity, and the air suction device adsorbs waste on the product surface and then discharges the waste.

Description

technical field [0001] The invention relates to the technical field of die-cutting waste discharge, in particular to a general die-cutting process for solving hole waste discharge. Background technique [0002] Existing products with more holes after die-cutting by a roller knife generally discharge the holes on the surface of the die-cut product through the thimble waste removal process. In actual use, the thimble waste needs to be carried out independently according to each mold production, and the waste cannot be completely discharged during waste discharge, resulting in a high non-discharge rate of product waste film, resulting in a defective rate of 20% to 50% of subsequent products, that is, the existing empty waste discharge process of die-cut products is less than The production cost is high, and the waste discharge effect is not good. Contents of the invention [0003] In view of the above problems, the present invention provides a general die-cutting process for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D7/18
CPCB26D7/1863
Inventor 王春生朱礼章陈小东王成
Owner SUZHOU ANJIE TECH
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