Substrate relay transfer system

A substrate-in-substrate technology, which is applied in the field of substrate-in-substrate transfer systems, can solve the problems of wasting waiting time, affecting substrate production efficiency and cost, and reducing substrate transportation and moving efficiency.

Pending Publication Date: 2021-02-09
孙建忠
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since only one actuator operates at a time, it causes waste of waiting time and reduces the efficiency of substrate transportation and movement, which greatly affects substrate production efficiency and cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate relay transfer system
  • Substrate relay transfer system
  • Substrate relay transfer system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] see figure 2 As shown, the present invention relates to a substrate relay transfer system, which includes a casing 1, and the casing 1 is used to protect internal mechanisms.

[0023] Cooperate figure 1 As shown, a transfer body 2 is arranged inside the casing 1, and the transfer body 2 can be used for temporarily storing materials while waiting for other conveying equipment to move intermediate products to different process positions.

[0024] The rotating body 2 of the present invention includes a pivot shaft 20, and the pivot shaft 20 extends outwards to a first loading port 21 and a second loading port 22 at two intervals, and there may be even more without being limited to the first loading port port 21 and the second bearer port 22 .

[0025] Cooperate Figure 4 As shown, an external conveying device 3 is further provided, and the external conveying device 3 can regularly place a substrate-type cassette 4 at the position of the first loading port 21; the subst...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a substrate relay transfer system, which comprises a casing, a transfer machine body is arranged in the casing, the transfer machine body comprises a pivot, and the pivot extends outwards to form a first bearing port and a second bearing port which are apart at an interval, so that a substrate box can be regularly placed at the position of the first bearing port. In addition to the first bearing port, the second bearing port is further arranged, the second bearing port is used for taking substrates such as wafers, and the first bearing port is prepared for switching when external conveying equipment (or manual operation) takes and places the substrates or the second bearing port is empty, so that the material taking and placing time of external conveying equipmentcan be saved.

Description

technical field [0001] The invention relates to a substrate conveying system, in particular to a substrate transfer system. Background technique [0002] There are substrate manufacturing processes in the industry, such as the operation of semiconductor wafer manufacturing and IC packaging equipment. The substrate is operated in the IC packaging equipment during the manufacturing process or after completion. During the manufacturing process, there must be a transfer body waiting for other conveying equipment to move to Different process locations. [0003] The transfer body of the previous technology has only one load port (Load Port). When there are no substrates such as wafers (Wafer) in the substrate cassette (Cassette), it needs to wait for the conveying equipment, such as OHT (Overhead Hoist Transfer, unmanned monorail in the air) Cart), that is, the transport system used in semiconductor manufacturing plants to take away the empty substrate cassette (Cassette), and th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677
CPCH01L21/67703H01L21/6773H01L21/67736
Inventor 孙建忠
Owner 孙建忠
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products