Glue sealing device for semiconductor diode

Abstract

The invention discloses a glue sealing device for a semiconductor diode, which belongs to the field of semiconductor manufacturing and comprises a base, two electric push rods are fixedly connected tothe top of the base, and a glue sealing groove body is fixedly connected to the top of the base. Lantern rings slidably connected with the two electric push rods are arranged on the outer sides of the two electric push rods in a sleeving mode, integrally-formed heating plates are fixedly connected to the front faces and the back faces of the two lantern rings, integrally-formed I-shaped frames are fixedly connected to the tops of the two electric push rods, and the tops of the two electric push rods are fixedly connected to the bottom ends of the two electric push rods; the top of the base isfixedly connected to the bottom of the glue sealing groove body, the outer sides of the two electric push rods are slidably connected to the inner sides of the two lantern rings correspondingly, andthe front faces and the back faces of the two lantern rings are fixedly connected to the opposite sides of the two heating plates correspondingly, so that the device has the advantages that lead bending is avoided, gluing is uniform, and drying is rapid and uniform.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, more specifically, to a sealing device for semiconductor diodes. Background technique [0002] The lead wire of the diode needs to be sealed with glue so that it can be prepared into a complete diode. In the existing glue sealing process, it is often through the repeated contact of the lead wire between the multiple seal teeth on the seal rack. , so that the glue on the sealing teeth can be glued to the leads. [0003] However, in the above-mentioned sealing device, the lead wire may be deformed and bent under the friction of the rubber teeth, resulting in the failure of the sealing, and the uniformity of the gluing of this device is poor and difficult to control, and it cannot be quickly and evenly glued after sealing. Drying of the glue solution leads to an increase in the rate of defective products, so we propose a sealing device for semiconductor diodes to solve the above problems ...

AI Technical Summary

Problems solved by technology

[0005]Aiming at the problems existing in the prior art, the object of the present invention is to provide a sealing device for semiconductor diodes, which can avoid lead bending and apply glue evenly , the advantages of rapid and uniform drying solve the above-mentioned sealing device, the lead wire may be deformed and bent under the friction of the rubber teeth, resulting in the failure of the sealing, and the gluing uniformity of this device is poor, difficult to control, and The glue solution cannot be dried quickly and evenly after sealing, resulting in an increase in the defective rate

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