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Multilayer interconnected electronic circuit board

A technology of electronic circuit boards and circuits, applied in the direction of printed circuits, printed circuits, printed circuit components, etc., can solve the problems of high cost and low utilization rate of circuit boards, achieve high product quality, speed up solder inflow, and reduce costs Effect

Pending Publication Date: 2020-12-25
成都大超科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the actual intersecting lines are relatively simple and few, using a circuit board with a large area will cause the disadvantages of low utilization rate and high cost

Method used

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  • Multilayer interconnected electronic circuit board
  • Multilayer interconnected electronic circuit board
  • Multilayer interconnected electronic circuit board

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Embodiment Construction

[0027] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0028] see figure 1 and figure 2 , the first embodiment of the present invention provides a multilayer interconnection electronic circuit board 1, the multilayer interconnection electronic circuit board 1 includes a main board 11 and one or more jumper boards 12, and the jumper boards 12 are far away from the main board One side of 11 is provided with a jumper line (not shown in the figure), and the side of the jumper board 12 close to the main board 11 is provided with a plurality of docking pads 121, and the butt pads 121 are provided with via holes 1211, The connecting pad 12...

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Abstract

The invention relates to a multilayer interconnected electronic circuit board, which comprises a main board and one or more secondary boards. Each secondary board is a single-sided window board, and the area of each secondary board is smaller than that of the main board. The surface, far away from the main board, of each secondary board is provided with a jumper circuit and a butt-joint bonding pad, and the butt-joint bonding pad is directly communicated with the jumper circuit. Each secondary board is provided with a window at a position corresponding to the butt-joint bonding pad, and the window exposes the butt-joint bonding pad with a proper size. The main board is provided with bonding pads at the positions corresponding to the butt-joint bonding pads of the secondary boards, and thebonding pads penetrate through the windows to be connected with the butt-joint bonding pads. The material utilization rate is high, and the cost can be effectively reduced.

Description

【Technical field】 [0001] The invention belongs to the technical field of circuit boards, in particular to a multilayer interconnected electronic circuit board. 【Background technique】 [0002] Whether it is a printed circuit board or a flexible circuit board, there is a problem of line crossing, but the wiring cannot be crossed, so it is necessary to mount another circuit board on one circuit board, and the unavoidable crossing lines are placed on another circuit board. Arrangement without crossing. When the actual intersecting lines are relatively simple and few, using a circuit board with a large area will cause the disadvantages of low utilization rate and high cost. 【Content of invention】 [0003] In order to overcome the problems in the prior art, the present invention provides a multilayer interconnected electronic circuit board. [0004] The solution of the present invention to solve the technical problem is to provide a multi-layer interconnected electronic circui...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11
CPCH05K1/0298H05K1/116H05K2201/09372H05K2201/09209
Inventor 张千向勇胡潇然游梦丽易娜
Owner 成都大超科技有限公司
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