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A kind of water-soluble photosensitive resin and its preparation method and application

A photosensitive resin and reaction technology, which is applied in the preparation of urea derivatives, chemical instruments and methods, and the preparation of organic compounds. It can solve the problems of long-term stable use, unstable mold size, and inability to show details, etc., and achieve good strength. And hardness, good temperature resistance, not easy to absorb water

Active Publication Date: 2022-02-18
FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this photosensitive resin needs to be dissolved with lye, which will decompose some casting materials, such as polymer materials containing ester groups, which is not conducive to large-scale application
Shihong Deng and others used the printing method of Shangluguang to print thermoplastic materials. The material can be dissolved in hot water, but the material is a thermoplastic material that is easy to absorb water and swell, making the size of the mold unstable, and it is not easy to use it stably for a long time. Secondly, due to The printed part is a thermoplastic material, without forming a cross-linked network, the surface will be dissolved in the monomer during the printing process, resulting in some details not being visible

Method used

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  • A kind of water-soluble photosensitive resin and its preparation method and application
  • A kind of water-soluble photosensitive resin and its preparation method and application
  • A kind of water-soluble photosensitive resin and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] 1. the preparation of ureido compound 1, concrete steps are as follows:

[0053]

[0054] At room temperature, mix 25.02g of diphenylmethane diisocyanate and 37.04g of 2-(tert-butylamino)ethyl methacrylate. After 0.5h of reaction, a small amount of sample is taken out, and the characteristic peak of NCO has completely disappeared by infrared detection. , indicating that diphenylmethane diisocyanate has completely reacted, adding 0.01g of hydroxyanisole to the reaction system, and stirring evenly, to obtain ureido compound 1, MS m / z (ESI): 643.34[M+23], attached figure 1 It is the NMR spectrum and mass spectrum of ureido compound 1.

[0055] 2. The process of preparing photosensitive resin and photocuring 3D printing using ureido compound 1 is as follows:

[0056] Urea-based compound 1 (5g), 4-acryloylmorpholine (95g), 2,4,6-trimethylbenzoyl-ethoxy-phenylphosphine oxide (2.5g), BASF’s Orisol Orange (0.25g) and BYK-302 (0.25g) were weighed in a beaker, stirred at 40°...

Embodiment 2

[0064] 1. the preparation of ureido compound 2, concrete steps are as follows:

[0065]

[0066] At room temperature, mix 22.2g of isophorone diisocyanate and 37.04g of 2-(tert-butylamino) ethyl methacrylate, after reacting for 0.5h, take out a small amount of sample, and use infrared detection-NCO characteristic peak has been completely disappear, indicating that isophorone diisocyanate has been completely reacted. Add 0.01g of hydroxyanisole to the reaction system and stir evenly to obtain ureido compound 2, MS m / z (ESI): 615.42[M+23].

[0067] 2. The process of preparing photosensitive resin and photocuring 3D printing with ureido compound 2 is as follows:

[0068] Urea-based compound 2 (30g), N,N-dimethylacrylamide (70g), 2,4,6-trimethylbenzoyl-ethoxy-phenylphosphine oxide (2.5g), Sudan I (0.25g), BYK-302 (0.25g) were weighed in a beaker, stirred at 40°C using a high-speed homogenizer for 20min, and finally stirred and defoamed with a vacuum planetary mixer for 10min t...

Embodiment 3

[0071] 3. the preparation of ureido compound 3, concrete steps are as follows:

[0072]

[0073] At room temperature, 16.0g of p-phenylene diisocyanate and 37.04g of 2-(tert-butylamino)ethyl methacrylate were mixed, and after reacting for 0.5h, a small amount of sample was taken out, and the characteristic peak of NCO had completely disappeared by infrared detection. It shows that the p-phenylene diisocyanate has been completely reacted, and 0.01 g of hydroxyanisole was added to the reaction system. After stirring evenly, the ureido compound 3 was obtained, MS m / z (ESI): 553.31 [M+23].

[0074] 2. The process of preparing photosensitive resin and photocuring 3D printing using ureido compound 3 is as follows:

[0075] Urea compound 3 (15g), N-vinylpyrrolidone (85g), bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide (2.5g), Sudan I (0.25g), BYK-302 (0.25g) was weighed in a beaker, stirred with a high-speed homogenizer at 40°C for 30 minutes, and finally stirred and defoamed ...

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PUM

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Abstract

The invention relates to a photosensitive resin composition, a preparation method and application thereof, and belongs to the field of intelligent polymer materials. The photosensitive resin of the invention is prepared from ureido compounds, monomers, photoinitiators, matting agents and leveling agents in a light-avoiding environment. The water-soluble printed parts formed by photocuring 3D printing can be dissolved in pure water or aqueous solution, as a sacrificial mold, so that materials that cannot be directly printed can also build three-dimensional structural products in this way.

Description

technical field [0001] The invention relates to a water-soluble photosensitive resin and its preparation method and application, belonging to the field of polymer materials. Background technique [0002] Light-curing 3D printing technology has the advantages of short manufacturing cycle, high molding precision, and customization, and is widely used in aerospace, industry, medical and other fields. The types and properties of 3D printing materials determine the development of light-curing 3D printing technology. and apply. Light-curing 3D printing materials generally need to be irradiated by ultraviolet light to quickly solidify to form the required parts. This is because light-curing 3D printing materials are mostly unsaturated resins. Energy, electronic transition, from the ground state to the excited state, forming active free radicals or cations. Under the action of active free radicals or cations, molecular chains containing unsaturated functional groups (mainly C=C bo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F220/58C08F220/06C08F222/22C08F220/54C08F226/10C07C273/18C07C275/14C07C275/40C07C275/26B33Y70/00
CPCC08F220/58C08F220/54C08F226/10C08F220/06C08F2/48C07C273/1827B33Y70/00
Inventor 彭枢强吴立新翁子骧钟捷缪佳涛
Owner FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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