Easy-to-tear cover tape and preparation method

A technology of cover tape and substrate layer, which is applied in the field of easy-tear cover tape and its preparation, and can solve the problems of hand-torn damage and difficult tearing of the cover tape, etc.

Active Publication Date: 2020-11-24
江西若邦科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing cover tape is not easy to tear. When the cover tape is not strong enough, it is easy to cause damage to the hand-torn part, making the cover tape more difficult to be torn.

Method used

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  • Easy-to-tear cover tape and preparation method
  • Easy-to-tear cover tape and preparation method

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Embodiment Construction

[0026] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings. Several embodiments of the invention are shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.

[0027] It should be noted that when an element is referred to as being “fixed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "left," "right," "u...

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Abstract

The invention discloses an easy-to-tear cover tape. The easy-to-tear cover tape comprises a wax layer, an antistatic layer, a base material layer and heat sealing layers which are sequentially arranged from top to bottom, wherein the two heat sealing layers are symmetrically arranged on the two sides of the bottom of the base material layer; a plurality of pressing blocks are arranged at the top of the wax layer; the pressing blocks are arranged in a protruding manner; the strength of the pressing blocks is greater than the maximum strength of the wax layer, the antistatic layer and the base material layer; the two heat sealing layers are oppositely provided with extrusion blocks correspondingly; the extrusion blocks are obliquely arranged; and the upper ends of the extrusion blocks are closer to the middle line of the base material layer. When the cover tape is torn off, the pressing blocks can be pressed firstly, so that a pressing region can sink; at the moment, the air pressure between the cover tape and a carrier tape is increased and the extrusion blocks can be pushed, namely an obliquely upward force is applied to the extrusion blocks; and the force is applied to the inner edges of the heat sealing layers, so that the connection force between the heat sealing layers and the carrier tape is weakened and the cover tape can be rapidly torn off by matching with an external pull force. The invention further discloses a preparation method adopting the cover tape.

Description

technical field [0001] The invention relates to the technical field of electronic packaging, in particular to an easy-to-tear cover tape and a preparation method. Background technique [0002] In order to protect electronic components from contamination and damage during transportation, they are usually loaded into pockets of carrier tape and sealed on the surface of the carrier tape with cover tape to form a closed package. [0003] Cover tapes are divided into heat-sealed cover tapes and pressure-sensitive cover tapes, among which heat-sealed cover tapes are more widely used. The heat-sealing cover tape is mainly a heat-sealing layer arranged on both edges of the cover tape. By melting the heat-sealing layer, the heat-sealing cover tape can be covered and pasted on the carrier tape to realize the packaging of electronic components. Electronics are quickly removed by peeling off the cover tape. [0004] The existing cover tape is not easy to be torn, and when the cover ...

Claims

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Application Information

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IPC IPC(8): B65D73/02B65D85/86B65D77/20
CPCB65D73/02B65D77/20B65D2585/86
Inventor 黄斌揭春生琚美文江佳
Owner 江西若邦科技股份有限公司
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