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Laser machining device, machining equipment, machining system and machining method

A laser processing and laser technology, which is applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problem of low utilization rate of laser energy, and achieve the effect of improving utilization rate and efficiency

Inactive Publication Date: 2020-11-13
HANS LASER TECH IND GRP CO LTD
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  • Application Information

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Problems solved by technology

It is used to solve the technical problem of low utilization rate of laser energy in the laser processing process of the prior art

Method used

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  • Laser machining device, machining equipment, machining system and machining method
  • Laser machining device, machining equipment, machining system and machining method
  • Laser machining device, machining equipment, machining system and machining method

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Embodiment Construction

[0053] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0054] Such as Figure 1 to Figure 5 As shown, in one embodiment, a laser processing device is proposed, which includes: a laser 10, an optical path selection mechanism 20, a first processing mechanism 31, a second processing mechanism 32, and a controller;

[0055] The optical path selection mechanism 20 is arranged between the laser 10 and the first processing mechanism 31 and the second processing mechanism 32;

[0056] The laser 10 is used to emit initial lase...

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Abstract

The embodiment of the invention discloses a laser machining device, machining equipment, a machining system and a machining method. A light path selection mechanism of the device is arranged between alaser device and a first machining mechanism and a second machining mechanism. The laser device is used for transmitting initial laser. A controller is used for being connected with the light path selection mechanism, the first machining mechanism and the second machining mechanism in a communicating manner, so that a first signal is obtained, the light path selection mechanism is controlled according to the first signal to send the initial laser to the first machining mechanism, and the first machining mechanism is controlled according to the first signal to carry out laser machining; the controller is further used for obtaining a second signal, the light path selection mechanism is controlled according to the second signal to send the initial laser to the second machining mechanism, andthe second machining mechanism is controlled according to the second signal to carry out laser machining. According to the laser machining device, the initial laser transmitted by the laser device isused for the first machining mechanism and the second machining mechanism to carry out laser machining, the utilization rate of laser energy is increased, and efficiency of laser machining is improved.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser processing device, processing equipment, processing system and processing method. Background technique [0002] The current laser processing process uses the manipulator to place the material on the processing station to realize the material loading. After visual camera positioning, laser processing is carried out, and the processed material is taken out from the processing station by the manipulator to realize the material unloading. The problem with this processing flow is that the laser processing time of the blank is less than the total time of the three processes of visual camera positioning, loading and unloading, resulting in low utilization rate of laser energy and improving the efficiency of laser processing. Contents of the invention [0003] Based on this, it is necessary to propose a laser processing device, processing equipment, processing system a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/06B23K26/082B23K26/70
CPCB23K26/0643B23K26/0821B23K26/702
Inventor 李启文赵佳祺张富民任莉娜张小军卢建刚何江玲尹建刚高云峰
Owner HANS LASER TECH IND GRP CO LTD
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