Resin sealing device and resin sealing method

Abstract

The present invention provides a resin sealing device and a resin sealing method which do not cause insufficient underfill and poor molding such as voids and bubbles even for large semiconductor chipsin recent years. This resin sealing device is provided with: an advancing / retreating member (11) and a control unit, wherein the advancing / retreating member is capable of entering a cavity recess (7)toward the surface (1A) of a substrate (1) and retreating from the cavity recess, and which surrounds at least a part of the entire circumference of the side surface (2A) of a semiconductor chip (2).In a state in which the advancing / retreating member is inserted into the cavity recess into the position of the connection surface (2C) of the semiconductor chip (2), a sealing resin (13) is injectedinto the cavity recess, a gap portion between the surface of the substrate and the connection surface (2C) of the semiconductor chip (2) and a gap portion between the surface (1A) of the substrate and the advancing / retreating member are filled with the sealing resin, then the advancing / retreating member is retracted from the cavity recess, and the entire side surface of the semiconductor chip isfilled with the sealing resin.

Description

technical field [0001] The present invention relates to a resin sealing device and a resin sealing method for resin sealing a molded object formed by flip-chip connecting a semiconductor chip on a surface of a substrate. Background technique [0002] After the semiconductor chip is flip-chip connected to the surface of the substrate, in order to protect the connection part and alleviate the influence of thermal stress between the substrate and the semiconductor chip, underfill is performed with a liquid sealing material, but in recent years , in order to reduce assembly costs and man-hours, so-called molded underfill (MUF) has been performed. As a conventional MUF-based resin sealing device, for example, the resin sealing device described in Patent Document 1 is known. Figure 11 (a) is a schematic bottom view of a molding die of the resin sealing device described in Patent Document 1, Figure 11 (b) is along Figure 11 The sectional view of A-A in (a), Figure 11 (c) is the...

AI Technical Summary

Problems solved by technology

However, there is such a problem that in the case of a semiconductor chip that has been made relatively large in recent years, when both sides of the semiconductor chip are closed, the connecting electrodes between the large-area semiconductor chip and the substrate will become a barrier for resin flow. Resistance, if the sealing resin flows only from one direction, it cannot flow to the gap part sufficiently, resulting in insufficient underfill

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