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Device of automatically applying heat conducting silicone grease on semiconductor chilling plates

A technology of thermally conductive silicone grease and cooling sheet, which is applied to devices and coatings that apply liquid to the surface.

Inactive Publication Date: 2020-10-13
TAIZHOU JIAOJIANG NANTUN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Technical problem: manual application of thermal conductive silicone grease on the surface of semiconductor refrigeration chips will be insufficient when a large amount of application is required, and manual application is prone to uneven application

Method used

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  • Device of automatically applying heat conducting silicone grease on semiconductor chilling plates
  • Device of automatically applying heat conducting silicone grease on semiconductor chilling plates
  • Device of automatically applying heat conducting silicone grease on semiconductor chilling plates

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Embodiment Construction

[0019] Combine below Figure 1-Figure 6 The present invention is described in detail, and for convenience of description, the orientations mentioned below are now stipulated as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.

[0020] The invention relates to a device for automatically applying heat-conducting silicone grease on a semiconductor refrigerating sheet, which is mainly used in the process of applying heat-conducting silicone grease on a semiconductor refrigerating sheet. The invention will be further described below in conjunction with the drawings of the invention: a A device for automatically applying heat-conducting silicone grease on a semiconductor refrigeration chip, including a support 11, a support 13 is fixed on the support 11, a support cavity 14 is provided in the support cavity 14, and a drive for driving is provided in the support cavity 14. The power unit 901, the upper end sur...

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PUM

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Abstract

The invention discloses a device of automatically applying heat conducting silicone grease on semiconductor chilling plates. The device comprises a supporting base. A support is fixedly arranged on the supporting base. The support is internally provided with a support cavity. The upper end face of the supporting base is fixedly provided with supporting frames in bilateral symmetry. A working platform is fixedly arranged on the supporting frames. The device provided by the invention implements automatic filling and automatic applying during the process of applying silicon grease to the semiconductor chilling plates, adopts the one-time applying and one-time filling mode in the applying process and prevents waste of silicone grease. The device can apply silicone grease to the multiple semiconductor chilling plates simultaneously in an automatic applying mode, and a lot of manpower is saved. Moreover, in the applying process, the device applies the silicone grease back and forth so that the device can apply the silicone grease to the surfaces of the semiconductor chilling plates more evenly to achieve the better heat dissipation effect.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a device for automatically applying heat-conducting silicone grease on a semiconductor refrigeration sheet. Background technique [0002] The semiconductor refrigerating sheet uses direct current during operation, and it can be heated or refrigerated. By changing the polarity of the direct current, it is decided to realize cooling or heating on the same refrigerating sheet. [0003] Semiconductor cooling sheets are commonly used in computer heat dissipation. A cooling sheet is inserted between the CPU and the radiator. Because there will be air on the contact surface of the semiconductor cooling sheet and the radiator, the heat dissipation effect will be inserted. It is said that the contact between the cooling sheet and the radiator will be Apply a layer of heat-conducting silicone grease. Generally, the heat-conducting silicone grease is applied either by using the press...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02B05C11/10B05C11/02
CPCB05C5/0208B05C11/028B05C11/10
Inventor 赵云
Owner TAIZHOU JIAOJIANG NANTUN ELECTRONICS CO LTD
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