Etching device for circuit board

A technology for etching devices and circuit boards, applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems affecting product production yield, and achieve the effect of avoiding the pool effect

Pending Publication Date: 2020-07-28
郑振华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above two problems have seriously affected the production yield of products

Method used

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  • Etching device for circuit board
  • Etching device for circuit board
  • Etching device for circuit board

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "bottom", "inner" and "outer" are based on the orientation or positional relationship shown in the drawings , is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the referred device or element must have a specific orientatio...

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PUM

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Abstract

The invention discloses an etching device for a circuit board. The etching device comprises a conveying device for conveying the circuit board along a preset direction, at least one spraying device, and at least air suction device, wherein any one of the spraying devices is arranged above the conveying device, the spraying device is used for spraying etching liquid to the circuit board, any one ofthe air suction devices is arranged above the conveying device, at least one air suction device is arranged at the downstream of the spraying device corresponding to the air suction devices along thepreset direction, so the air suction device can suck the reacted etching liquid sprayed by the spraying device corresponding to the air suction device. The etching device is advantaged in that by arranging the air suction devices, the etching liquid retained in the sunken area after reaction can be sucked, further lateral etching of the etching liquid retained in the sunken area is avoided, and the fresh etching liquid can better react with the circuit board.

Description

technical field [0001] The invention relates to a device for manufacturing circuit boards, in particular to an etching device for circuit boards. Background technique [0002] The circuit board is an indispensable basic component in electronic products. The circuit board is manufactured by spraying etching solution on the surface of the substrate and etching the copper foil to form a conductive circuit. However, in the etching process, a phenomenon called "pool effect" often occurs, that is, the copper foil on the surface of the substrate will form a recessed area after etching, and the reacted etching solution will easily stay in the recessed area, and then make its The fresh etchant sprayed later cannot enter the recessed area between the two lines to continue etching, resulting in the copper etching at the bottom being unsuccessful and causing a short circuit; or, the reacted etchant stays in the recessed area, so that the side of the recessed area is continuously eroded ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
CPCH05K3/068
Inventor 郑振华
Owner 郑振华
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