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Gluing device

A glue coating device and glue technology, which is applied to the surface coating liquid device, coating, etc., can solve the problems that are not suitable for fast-paced mass production, low glue viscosity, and difficult operation

Pending Publication Date: 2020-07-07
国机智能科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because PUR hot melt adhesive is greatly affected by temperature, it is easy to solidify in advance in winter, and it is easy to affect the bonding quality of the product. At the same time, due to the low viscosity of this type of adhesive, it is easy to cause misalignment and offset in the composite action after sizing.
[0003] In addition, in the existing automatic gluing equipment, the positioning of the plates that need to be glued is generally done by setting up a blocking mechanism in the forward direction and pushing the side cylinder, and most of the locating mechanisms are arranged directly above or on the side of the conveying mechanism, which affects Subsequent transfer process of production line to plate
And it only positions a single specification of panels. When replacing panels of different specifications for production, it is necessary to disassemble part of the blocking mechanism in advance to achieve compatibility, and every time the blocking mechanism needs to be repositioned and installed, the disassembly time is relatively long. Long, difficult to operate, not suitable for fast-paced mass production

Method used

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Embodiment Construction

[0032] This section will describe the specific embodiments of the present invention in detail. The preferred embodiments of the present invention are shown in the accompanying drawings. The function of the accompanying drawings is to supplement the description of the text part of the manual with graphics, so that people can intuitively and vividly understand the text. Each technical feature and overall technical solution of the invention cannot be understood as a limitation on the protection scope of the present invention.

[0033] In the description of the present invention, it should be understood that the orientation description involved, such as up, down, front, back, left, right, etc., indicates the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the pointed device or element...

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Abstract

The invention discloses gluing device. The gluing device comprises a conveying track and a glue application module, wherein the conveying track is used for conveying products, the glue application module is arranged above the conveying track and comprises a low-viscosity glue spray system and a high-viscosity glue spray system, the low-viscosity glue spray system comprises low-viscosity glue and afirst glue gun, and the high-viscosity glue spray system comprises high-viscosity glue and two second glue guns. According to the gluing device, the low-viscosity glue and the high-viscosity glue areadopted to replace traditional PUR hot melt glue, the low-viscosity glue has relatively low viscosity, is less affected by temperature and can be prevented from curing in advance under the conditionof relatively low temperature, and product bonding quality is ensured; and the second glue guns are arranged on two sides of the first glue gun and apply the high-viscosity glue to edge positions of two sides of the product, so that dislocation and offset of composite actions due to insufficient viscosity after application of the low-viscosity glue are avoided. The gluing device is used in the technical field of glue joint.

Description

Technical field [0001] The invention relates to the technical field of adhesive bonding, in particular to a gluing device. Background technique [0002] In the field of automatic bonding, in order to meet the sizing process requirements of specified products, a large area of ​​uniform "full coating" needs to be achieved, so PUR hot melt adhesives are generally used to achieve bonding. However, because PUR hot melt adhesives are greatly affected by temperature, they are easy to solidify in advance in winter, which easily affects the bonding quality of the product. At the same time, due to the low viscosity of this type of adhesive, it is prone to misalignment and offset in the compound action after sizing. [0003] In addition, in the existing automatic bonding equipment, the positioning of the plates to be bonded is generally performed by setting up a blocking mechanism in the forward direction and pushing by a side cylinder, and the positioning mechanism is mostly arranged directl...

Claims

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Application Information

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IPC IPC(8): B05C5/02B05C13/02
CPCB05C5/027B05C13/02
Inventor 梅雪川叶敏郭如峰郭鹏林粤科高燕李保民
Owner 国机智能科技有限公司
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