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Package with acoustic sensing device(s) and millimeter wave sensing elements

A technology for sensing elements and packages, applied to devices with phase adjustment/time delay error compensation, electrical components, measuring devices, etc., can solve the problems of coexistence of complex, complicated and huge equipment in miniaturized equipment

Pending Publication Date: 2020-05-22
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Correspondingly complex and bulky equipment due to the need for multiple elements of the microphone array and radar
Coexistence in miniaturized devices is complicated by the fact that both different microphones and different antennas will be spatially distributed according to different directions

Method used

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  • Package with acoustic sensing device(s) and millimeter wave sensing elements
  • Package with acoustic sensing device(s) and millimeter wave sensing elements
  • Package with acoustic sensing device(s) and millimeter wave sensing elements

Examples

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Embodiment Construction

[0035] figure 1 A first example of a package 100 is shown. Package 100 includes a package structure 102 that defines inner surfaces 108a, 110a, 112a and outer surfaces 108b, 110b, 112b. The interior surfaces 108a, 110a, 112a define an interior volume 104 for housing circuit components. In this example the inner volume 104 is empty, but in a variant this inner volume 104 could be filled with a filler material.

[0036] The package structure 102 may include, for example, at least one of a first planar element 108, a second planar element 112, and at least one lateral element 110 (the lateral element 110 may be a planar element). At least one lateral member 110 may be elongated in a direction parallel to the thickness of the package body 100 . The first planar element 108 and the lateral element(s) 110 may form (eg, be integrated in a single element) the cover 106, while the second planar element may be a laminate (different variants may be provided). At least one of the firs...

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Abstract

There are provided examples of packages and methods for manufacturing the same. A package (100, 200, 400) as here described may comprise:- a package structure (102, 402) which defines inner surfaces (108a, 110a, 112a) delimiting an inner volume (104) and outer surfaces (108b, 110b, 112b) directed towards an exterior of the package (100, 200, 400);- at least one acoustic sensor element (120) applied to at least one of the inner surfaces (108a, 110a, 112a), to convert acoustic waves arriving from the exterior of the package (100, 200, 400) into acoustic information in the form of electric signals;- a plurality of millimeter wave sensing elements (140) applied to at least one of the outer surfaces (108b, 110b, 112b), to receive reflected radar signals from objects in the exterior of the package (100, 200, 400); and- a circuitry (160) applied to at least one of the inner surfaces (108a, 112a) of the package structure (102, 402), wherein the circuitry (160) is electrically connected to theat least one acoustic sensor element (120) and the plurality of millimeter wave sensing elements (140) to process the acoustic information and the reflected radar signals.

Description

technical field [0001] This document relates to a package which may comprise at least one acoustic sensor element and at least one millimeter wave sensing element. This document also relates to a method for manufacturing a package. Background technique [0002] Radar-assisted microphone array applications rely on audio beamforming capabilities assisted by radar capabilities. The audio beamforming function allows noise reduction from sound sources different from the intended sound source. The radar function allows identification of target sound sources. [0003] Due to the multiplicity of elements required for the microphone array and the radar, correspondingly complex and bulky equipment is required. Coexistence in miniaturized devices is complicated by the fact that both different microphones and different antennas will be spatially distributed according to different directions. [0004] Therefore, it is necessary to strive to reduce the size of similar devices. Conte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/04H01L25/16G01S13/06
CPCH01L23/04H01L25/16G01S13/06G01S3/8083G01S3/82G01S3/86G01S7/521G01S13/86G01S7/027G10L15/22H04R1/025H04R3/00H04R31/006
Inventor 蔡国耀黄志洋
Owner INFINEON TECH AG
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