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A taper-free laser cutting method

A laser cutting, taper-free technology, applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve problems such as taper problems, achieve taper-free cutting, avoid beam blocking problems, and increase the effect of the range

Active Publication Date: 2022-05-20
XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to mainly solve the problem of taper produced in the process of laser processing, and to provide a taper-free laser cutting method

Method used

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  • A taper-free laser cutting method
  • A taper-free laser cutting method
  • A taper-free laser cutting method

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Embodiment Construction

[0029] Below in conjunction with accompanying drawing and specific embodiment the content of the present invention is described in further detail:

[0030] At present, ultra-fast lasers mainly use galvanometer processing to cut materials, but the galvanometer line scanning cutting method cannot solve the problem of cutting taper at one time. Aiming at the problems of damage and taper in the cutting process of airgel and other thermal structural materials with high requirements on damage and size, the invention provides a method for realizing low damage and no taper cutting by using a vibrating mirror.

[0031] Such as figure 1 As shown, the present invention adopts the existing laser processing system, which includes a laser, a beam expander, two mirrors, a vibrating mirror system and a field mirror arranged in sequence along the optical path. The femtosecond infrared laser with a wavelength of 1030nm is selected as the laser, and the telecentric field mirror with a focal len...

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Abstract

The invention relates to a taper-free laser cutting method, which mainly solves the taper problem generated in the laser processing process. The method includes: 1) dividing the kerf into K sections along the height direction of the kerf; 2) dividing the first section of the kerf into P layers along the height direction, and scanning the laser sequentially from the first layer to the last layer; the material to be cut The kerf cutting surfaces are A surface and B surface respectively. The laser scanning of each layer starts from A surface until the left filling surface of this layer is scanned, and then starts again from B surface until the right filling surface of this layer is scanned. ;The left filling surface of each layer is based on surface A and extends to surface B, and the right filling surface of each layer is based on surface B and extends to surface A; the dimensions of the left filling surfaces from the first layer to the last layer are in order Decrease, the size of the right filling surface from the first layer to the last layer decreases in turn; 3) Laser feed, refer to step 2), cut the second section of the slit until the K section slit is cut.

Description

technical field [0001] The invention relates to an ultrafast laser processing technology, in particular to a taper-free laser cutting method. Background technique [0002] Airgel materials are mainly used in high-temperature service environments such as aviation and aerospace, and their thermal insulation and structural integrity during use often directly affect the service life of the entire system. Therefore, in the processing and preparation of airgel materials It also has quite strict technical requirements. [0003] The traditional processing methods of airgel materials are mechanical processing, high-pressure water jet processing and long pulse laser processing. However, this kind of processing method is easy to cause burrs, delamination, tearing, chipping, hot melting and other damage on the surface of airgel materials. At the same time, for structural parts with high size requirements, there are often serious tapers after cutting with the above method Problems, it ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/402B23K26/14
CPCB23K26/38B23K26/402B23K26/14
Inventor 朱文宇王宁麻丁龙田东坡王三龙
Owner XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI
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