Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor refrigeration device

A refrigeration device and semiconductor technology, which is applied in the direction of household refrigeration devices, cooling fluid circulation devices, refrigerators, etc., can solve the problems of cooling capacity loss, energy consumption increase, and low cooling efficiency of refrigeration equipment, so as to avoid the loss of cooling capacity, Good cooling efficiency

Pending Publication Date: 2020-04-21
杭州非同工业设计有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the cold end and the hot end of the semiconductor refrigeration chip are set opposite to each other, and the cold end radiator and the hot end radiator are adjacent to each other, the cold end and the hot end radiator are prone to heat exchange, resulting in the loss of cooling capacity, thus making the refrigeration equipment Less efficient cooling and increased energy consumption

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor refrigeration device
  • Semiconductor refrigeration device
  • Semiconductor refrigeration device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0039] Please refer to Figure 1-Figure 12 As shown, a semiconductor refrigeration device of the present invention includes a box body 1, and a flow guiding part 2 is arranged in the box body 1, and at least one group of semiconductor thermopiles 3 are arranged in the flow guiding part 2, and the upper left end of the box body 1 is provided with There is an outer air inlet 11, an outer air outlet 12 is provided on the lower side of the left end, an inner air inlet 13 is arranged on the upper right side, an inner air outlet 14 is arranged on the lower right side, th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a semiconductor refrigeration device. The semiconductor refrigeration device comprises a box body; a flow guide component is arranged in box body; at least one set of semiconductor thermopile is arranged in the flow guide component; an outer air inlet is formed in the upper side of the left end of the box body; an outer air outlet is formed in the lower side of the left end of the box body; an inner air inlet is formed in the upper side of the right end of the box body; an inner air outlet is formed in the lower side of the right end of the box body; the outer air inlet is communicated with the outer air outlet through the flow guide component, so that an outer circulation air duct can be formed; the inner air inlet is communicated with the inner air outlet throughthe flow guide component, so that an inner circulation air duct can be formed; the semiconductor thermopile comprises heat absorption areas and heat release areas which are distributed alternately; the outer circulation air duct passes through the heat release areas; and the inner circulation air duct passes through the heat absorption areas. According to the semiconductor refrigeration device ofthe invention, the outer circulation air duct and the inner circulation air duct are adopted; the semiconductor thermopile is provided with the heat absorption areas and the heat release areas whichare distributed alternately; the outer circulation air duct passes through the heat release areas; the inner circulation air duct passes through the heat absorption areas; and therefore, the cold endand hot end of the semiconductor thermopile do not exchange heat, the loss of cooling capacity is avoided, and refrigerating efficiency is good.

Description

technical field [0001] The invention belongs to the technical field of electronic refrigeration equipment, in particular to a semiconductor refrigeration device. Background technique [0002] At present, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration chips for cooling is widely used, and semiconductor refrigeration chips include a cold end that releases cold energy and a hot end that releases heat. The cold end releases cold energy into the refrigeration compartment of the refrigeration equipment through the cold end radiator, while the hot end of the semiconductor cooling chip needs to dissipate heat to the outside through the hot end radiator. However, in the actual use of the hot end radiator, the heat dissipation capacity of the radiator directly affects the cooling capacity and cooling efficiency of the semiconductor. Since the cold end and the hot end of the semiconductor refrigeration chip are...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02F25B49/00F25D17/08F25D21/04H05K7/20
CPCF25B21/02F25B49/00F25D17/08F25D21/04H05K7/2039
Inventor 罗红英蔡自立张浩勋
Owner 杭州非同工业设计有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products