System and method for obtaining etching liquid injection speed

A technology of jet velocity and acquisition system, applied in the direction of using wave/particle radiation for material analysis, instruments, analysis materials, etc., can solve the problem of high cost and achieve the effect of solving the high cost

Active Publication Date: 2022-04-26
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention provides a system and method for obtaining the spraying speed of etching solution, so as to solve the technical problem of high cost caused by the need to test on the display panel manufacturing line existing in the current technology

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • System and method for obtaining etching liquid injection speed
  • System and method for obtaining etching liquid injection speed
  • System and method for obtaining etching liquid injection speed

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are only for reference The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the figures, structurally similar elements are denoted by the same reference numerals.

[0037] The embodiment of the present invention can solve the technical problem of high cost caused by testing on the display panel manufacturing line in the prior art.

[0038] In one embodiment, as figure 1 and image 3 As shown, the etching solution injection speed acquisition system provided by the embodiment of the present invention includes:

[0039] The beaker...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention provides a system and method for obtaining the spraying speed of etching solution. The method provides a beaker test device, then controls the beaker test device to be in a preset environmental condition, and controls the movement of the driving member, so that the etching sample and The etching solution moves relative to a preset speed, on this basis, detects the etching parameters of the etching sample, constructs the corresponding relationship between environmental conditions, speed and etching parameters, and determines the target etching parameters and target environmental conditions according to the corresponding relationship corresponding target speed, and calculate the spray speed of the etching solution according to the target speed; the method does not need to test the spray speed on the display panel manufacturing line, which solves the need of the current technology to be carried out on the display panel manufacturing line Cost-prohibitive technical problems caused by testing.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a system and method for obtaining the spraying speed of etching solution. Background technique [0002] During the manufacturing process of the display panel, it is necessary to use an etchant to etch the film layer (such as a metal film layer such as a copper layer) to form a required pattern, such as a source electrode, a drain electrode, and the like. Etching solutions of different specifications (such as etching solutions of different concentrations, etching solutions of different manufacturers, etc.) have different etching rates on the film layer, which leads to the different specifications of etching solutions on the film layer under the same environmental conditions and spraying speed. The etching results are different (reflected by different etching parameters). [0003] A display panel of each specification requires a better etching parameter. In order to obtai...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G01N23/2251G01N1/28C23F1/08
CPCG01N23/2251G01N1/28C23F1/08
Inventor 梅园
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap