Butt coupling method used for monolithic integrated chip

Abstract

The invention discloses a butt coupling method used for a monolithic integrated chip. The method comprises the following steps of S1, generating a first active functional device on a substrate, dividing an InP buffer layer into two parts by the device through a light field control layer, and realizing complete alignment of an active region center of the first functional device and an active regioncenter of a second functional device by controlling a growth thickness of a second buffer layer; S2, depositing a dielectric film, defining the second functional device through lithography etching, and reducing reflection at an interface of the first functional device and the second functional device through a certain angle between a tail end of a mask and an optical waveguide direction; S3, removing a partial region of the first functional device by adopting an etching and selective corrosion method; S4, carrying out high-temperature heat treatment on the first functional device to form a smooth side wall interface and an undercut with a certain length; and S5, growing the second functional device in a butt joint manner. Coupling efficiency is high, and a transmission characteristic is good.

Description

technical field [0001] The invention relates to monolithic integrated chip technology, in particular to a butt coupling method for monolithic integrated chips, which is used in the manufacturing process of monolithic integrated chips. Background technique [0002] The main purpose of monolithic photonic integrated chips is to monolithically integrate at least two functional devices, including integration between active devices, such as semiconductor lasers, semiconductor optical amplifiers, electroabsorber modulators, semiconductor photodetectors, and Integration of active and passive devices, such as optical waveguides, multimode interferometers, mode spot converters, gratings, etc. Compared with discrete devices, monolithic integrated devices can complete more complex functions than discrete devices through the combination of components, which greatly reduces the coupling cost and packaging cost of different devices, and is excellent in optical, electrical performance, sta...

AI Technical Summary

Problems solved by technology

Traditional docking methods, such as the patent US7018861B2, cannot solve two major problems. One is that the thickness of the materials in different functional areas is inconsistent, and the centers of the active areas of the two need to be completely aligned to avoid the mismatch of optical fields in different functional areas, which will cause low cou

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