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Photosensitive intelligent MEMS microphone

A microphone and intelligent technology, applied in the field of microphones, can solve the problems of not being able to perceive environmental changes, adjusting the working mode, and the working mode is not intelligent enough.

Inactive Publication Date: 2020-01-03
朝阳聚声泰(信丰)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current MEMS microphone enters the working state when the appropriate voltage is provided, and the working method is not smart enough to sense the environmental changes and adjust the working method

Method used

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Examples

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Embodiment 1

[0022] Embodiment 1: as figure 1 , figure 2 , Figure 4 with Figure 5 As shown, the present invention discloses a photosensitive intelligent MEMS microphone, comprising a packaging substrate 5 and a photosensitive resistor 1, a Sensor chip 4 is fixed on the packaging substrate 5, and the Sensor chip 4 is electrically connected to the ASIC chip 3 through a bonding wire 7, and the ASIC It is electrically connected with the packaging substrate 5, and the photoresistor 1 is connected in series with a fixed resistor 8 and then connected to the positive pole of the power supply. A photosensitive substrate with a photoresistor 1 fixed on the board 2, a BIAS terminal and a VOUT terminal on the Sensor chip 4, the BIAS terminal on the Sensor chip 4 is electrically connected to the BIAS terminal of the ASIC chip 3, and the VOUT terminal on the Sensor chip 4 is connected to the ASIC terminal The VOUT terminal of the chip 3 is electrically connected. The working principle of the MEMS...

Embodiment 2

[0027] Embodiment 2: as figure 1 , image 3 , Figure 4 with Figure 5As shown, the present invention discloses a photosensitive intelligent MEMS microphone, comprising a packaging substrate 5 and a photosensitive resistor 1, a Sensor chip 4 is fixed on the packaging substrate 5, and the Sensor chip 4 is electrically connected to the ASIC chip 3 through a bonding wire 7, and the ASIC It is electrically connected with the packaging substrate 5, and the photoresistor 1 is connected in series with a fixed resistor 8 and then connected to the positive pole of the power supply. A photosensitive substrate with a photoresistor 1 fixed on the board 2, a BIAS terminal and a VOUT terminal on the Sensor chip 4, the BIAS terminal on the Sensor chip 4 is electrically connected to the BIAS terminal of the ASIC chip 3, and the VOUT terminal on the Sensor chip 4 is connected to the ASIC terminal The VOUT terminal of the chip 3 is electrically connected. The working principle of the MEMS m...

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PUM

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Abstract

The invention relates to the field of microphones, in particular to a photosensitive intelligent MEMS microphone. The photosensitive intelligent MEMS microphone comprises a packaging substrate and a photoresistor; a Sensor chip is fixed on the packaging substrate; the Sensor chip is electrically connected with the ASIC chip through a bonding wire; the ASIC is electrically connected with the packaging substrate; the photosensitive resistor is connected with a positive electrode of a power supply after being connected with a fixed resistor in series, a power supply end of the ASIC chip is connected with the photosensitive resistor through a triode, a cavity plate is fixed on the packaging substrate, and a photosensitive substrate on which the photosensitive resistor is fixed is placed on thecavity plate. Through the photosensitive intelligent MEMS microphone, the function of intelligently starting the microphone according to the illumination intensity can be realized.

Description

【Technical field】 [0001] The invention relates to the field of microphones, in particular to a photosensitive intelligent MEMS microphone. 【Background technique】 [0002] MEMS is a micro-electromechanical system. The full English name is Micro-Electro mechanical System. It refers to a sensor device with a size of a few millimeters or even smaller. Its internal structure is generally on the order of microns or even nanometers. It is an independent intelligent system. To put it simply, MEMS is to miniaturize the mechanical components of traditional sensors, fix the devices on silicon wafers (wafers) through three-dimensional stacking technologies, such as three-dimensional through-silicon vias (TSVs), and finally use special customized sensors according to different applications. Package form, and finally cut and assemble the silicon-based sensor. Benefiting from the cost advantage brought by the mass production of IC silicon wafer processing that cannot be achieved by ordina...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/00
CPCH04R19/005H04R2201/003
Inventor 杨国庆仪保发郭智华
Owner 朝阳聚声泰(信丰)科技有限公司
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