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Double-sided manufacturing system for wafer

A wafer, double-sided technology, applied in the field of wafer double-sided production system, can solve problems such as scratches, particle dust, etc., to save costs, avoid pollution or scratches, and avoid dust pollution or scratches.

Active Publication Date: 2020-01-03
NINGBO SEMICON INT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] If you want to realize the double-sided operation of the wafer, then you must realize the flipping of the front and back sides of the wafer and the horizontal rotation of the wafer. Particle dust or even scratches caused by contact

Method used

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  • Double-sided manufacturing system for wafer
  • Double-sided manufacturing system for wafer

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Embodiment Construction

[0048]The present invention will be described in more detail below with reference to the accompanying drawings. Although preferred embodiments of the invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0049] figure 1 shows a schematic diagram of a wafer double-sided fabrication system according to an embodiment of the present invention, figure 2 It shows a schematic structural diagram of a wafer turning mechanism of a wafer double-sided production system according to an embodiment of the present invention, as shown in Figure 1 to Figure 2 As shown, a wafer double-sided production system includes:

[0050] A wafer carrier 3, a wafer inversion mechanism 2, and a wafer transfer mec...

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Abstract

The invention discloses a double-sided manufacturing system for a wafer. The double-sided manufacturing system comprises a wafer bearing platform, a wafer overturning mechanism and a wafer transfer mechanism. The wafer overturning mechanism comprises a first clamping part, a second clamping part, a clamping and positioning part and a clamping and overturning part. The first clamping part comprisesa first clamping substrate and a first clamping part provided with a first slot part. The second clamping part comprises a second clamping substrate and a second clamping part. The second clamping part is provided with a second slot part opposite to the first slot part. The clamping and positioning part comprises a positioning track and a positioning part, the positioning part is connected to thepositioning track and the clamping part, a first position, to which the movable clamping part moves along the positioning track, is a position where the first slot part and the second slot part are attached to form a slot to clamp the edge of the wafer, and a second position is a position where the wafer is loosened by the slot. The clamping and overturning part comprises an overturning driving part which connects the first clamping part with the second clamping part. By matching the first clamping part with the second clamping part, the wafer is overturned by clamping the edge area of the wafer only, so that the front and back faces of the wafer are prevented from being polluted or scratched by dust.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and more specifically, to a wafer double-sided manufacturing system. Background technique [0002] Advanced integrated circuit manufacturing processes generally include hundreds of steps, many of which involve double-sided operations on wafers, such as double-sided cleaning of wafers, marking on both sides of wafers, and double-sided etching. . [0003] If you want to realize the double-sided operation of the wafer, then you must realize the flipping of the front and back sides of the wafer and the horizontal rotation of the wafer. The problem of particle dust and even scratches is caused by contact. [0004] Therefore, the present invention proposes a scheme based on wafer flipping, which can avoid contamination and scratches on the wafer surface, and can simultaneously engrave markings on both sides of the wafer. Contents of the invention [0005] The object of the present i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B23K26/70
CPCB23K26/362B23K26/70B23K26/702
Inventor 武瑞杰
Owner NINGBO SEMICON INT CORP
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