A kind of photosensitive resin composition and its application

A technology of photosensitive resin and resin composition, which is applied in the field of photosensitive resin composition to achieve the effects of small stripped film fragments, excellent flexibility, and improved production efficiency and product yield.

Active Publication Date: 2022-03-11
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Patent document CN102144189B provides a kind of photosensitive resin composition, by adding polyoxyethylene (tris(1-phenylethyl)) phenyl ether modified by ethylene oxide, its resolution, adhesion, capping performance Excellent, good peel performance but still room for improvement

Method used

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  • A kind of photosensitive resin composition and its application
  • A kind of photosensitive resin composition and its application

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Embodiment Construction

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below. Apparently, the described embodiments are some, not all, embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present invention belongs.

[0028] 1. Specific components and their weight ratios in the photosensitive resin compositions of Examples 1-9 and Comparative Examples 1-2 (see Table 1)

[0029] (1) Alkali-soluble resin A: prepared by solution pol...

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Abstract

The invention discloses a photosensitive resin composition and its application. The resin composition includes 40-70 parts by weight of alkali-soluble resin, 20-50 parts by weight of photopolymerizable monomer, 0.5-10.0 parts by weight of photoinitiator and 0.1-10.0 parts by weight of additives; the additives include 0.1-8.0 parts by weight Parts of plasticizers containing carbonate structure. The photosensitive resin composition is used as a dry film resist and has the advantages of fast film removal speed, small film removal fragments, excellent flexibility and the like.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, in particular to a photosensitive resin composition and its application. Background technique [0002] In the production process of printed circuit boards, photosensitive resin compositions are widely used. The photosensitive resin composition can produce a polymerization reaction after being irradiated by ultraviolet rays to form a stable substance attached to the plate surface, so as to become a resist material in the electroplating and etching process. As the amount of data transmitted by information continues to increase, PCB functions increase accordingly, component sizes become smaller and smaller, and the update frequency of new-generation smart electronic products becomes more and more frequent. This puts forward higher requirements for high-precision, high-density, and high-efficiency productivity of printed circuit boards. This puts forward higher requirements on the pe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/027
CPCG03F7/004G03F7/027
Inventor 朱高华李伟杰周光大
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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