A printed circuit board automatic control copper sinking process

Abstract

The invention provides an automatic control copper sinking process for a printed circuit board, and a super-depth-of-field microscope and a control system need to be provided. The super-depth-of-field microscope is connected with the control system and is controlled by the control system. The process includes: drilling a PCB board; removing the Burr in the hole; horizontal copper sinking; sample the PCB board after copper sinking, scan the sample board with an ultra-depth-of-field microscope, and obtain an image of the inner side of the hole. The percentage value is output to the control system; if the percentage value exceeds the preset value, stop the above-mentioned horizontal copper sinking operation, adjust the copper sinking parameters according to the comparison result, and restart the above-mentioned horizontal copper sinking operation; if it does not exceed the preset value , the subsequent steps of the circuit board are performed. By introducing 3D imaging technology into circuit board production, the invention realizes quantitative detection of light transmission points, improves the accuracy and detection speed of backlight determination, realizes industrial automation, and improves production efficiency and quality.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to an automatic control copper sinking process of a printed circuit board. Background technique [0002] The traditional copper sinking process mainly includes sinking copper out of the board -> backlight judgment -> production control. Among them, sinking copper out of the board refers to sinking copper after drilling the PCB board. The sinking copper refers to electroless copper sinking (Plated Through Hole), that is, plated through hole, referred to as PTH, which is a process used in the production of printed circuit boards. It is an extremely important process, the purpose of which is to cover the non-conductor hole wall with a dense and firm metal copper layer as a conductor by means of chemical deposition, so that the lines between two or more layers of the circuit board are connected and conductive; backlight determination And production control means that after...

AI Technical Summary

Problems solved by technology

Due to the following defects in the traditional backlight judgment: 1. Destructive test, the hole needs to be ground to the hole radius with a grinder, and the light is irradiated with a metal microscope to see the degree of light transmission in the hole. The place covered by the sunken copper layer is not transparent. Light, according to the backlight progression table to judge, this process is a qualitative judgment, the accuracy is not high; 2, according to the backlight judgment and then adjust the copper sinking parameters, because the backlight judgment process requires grinding and other operations, it takes a long time 3. In the process of determining the backlight, if the potion fails, the produced board cannot be adjusted in time, and the quality risk of the outflowing product exists

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