A kind of aldehyde-free flour-based adhesive and preparation method thereof
A flour and glue-based technology, applied in adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve problems such as poor water resistance bonding performance, environmental pollution of human settlements, free formaldehyde release, etc., to achieve enhanced glue Good bonding performance, improved cross-linking density, and good uniformity
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Embodiment 1
[0035] This embodiment provides a preparation method of flour adhesive, and the adhesive is prepared according to the following weight ratio:
[0036] Modified flour 38 kg
[0037] Surface modified attapulgite 0.4 kg
[0038] Polyacrylamide 0.1kg
[0039] Self-made multifunctional epoxy compound 8kg
[0040] Sodium hydroxide solution 0.5kg
[0041] This embodiment also provides the preparation method of the above-mentioned adhesive, and the specific preparation steps are as follows:
[0042] (1) Weigh the components according to the weight ratio, add the surface-modified attapulgite to the dispersion medium water, ultrasonicate for 15 minutes, and then add half the weight of modified flour, use a high-pressure homogenizer, under 30MPa pressure and 0.5MPa Under the action of emulsifying force, homogeneously emulsify for 20 minutes;
[0043] (2) Add the remaining modified flour to the mixture obtained in step (1), mix well, add self-made multifunctional epoxy compound and t...
Embodiment 2
[0045] This embodiment provides a preparation method of flour adhesive, and the adhesive is prepared according to the following weight ratio:
[0046] Modified flour 42kg
[0047] Surface modified attapulgite 0.8 kg
[0048]Polyacrylamide 0.3kg
[0049] Self-made multifunctional epoxy compound 12kg
[0050] Sodium hydroxide solution 1.0kg
[0051] The preparation method of the adhesive described in this embodiment is the same as that in Example 1.
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