Aldehyde-free flour-based adhesive and preparation method thereof
An adhesive and flour technology, applied in the directions of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of human settlement environment pollution, free formaldehyde release, poor water-resistant bonding performance, etc. Cross-linking density, good uniformity, and the effect of enhancing bonding performance
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Embodiment 1
[0035] This embodiment provides a preparation method of flour adhesive, and the adhesive is prepared according to the following weight ratio:
[0036] Modified flour 38 kg
[0037] Surface modified attapulgite 0.4 kg
[0038] Polyacrylamide 0.1kg
[0039] Self-made multifunctional epoxy compound 8kg
[0040] Sodium hydroxide solution 0.5kg
[0041] This embodiment also provides the preparation method of the above-mentioned adhesive, and the specific preparation steps are as follows:
[0042] (1) Weigh the components according to the weight ratio, add the surface-modified attapulgite to the dispersion medium water, ultrasonicate for 15 minutes, and then add half the weight of modified flour, use a high-pressure homogenizer, under 30MPa pressure and 0.5MPa Under the action of emulsifying force, homogeneously emulsify for 20 minutes;
[0043] (2) Add the remaining modified flour to the mixture obtained in step (1), mix well, add self-made multifunctional epoxy compound and r...
Embodiment 2
[0045] This embodiment provides a preparation method of flour adhesive, and the adhesive is prepared according to the following weight ratio:
[0046] Modified flour 42kg
[0047] Surface modified attapulgite 0.8 kg
[0048]Polyacrylamide 0.3kg
[0049] Self-made multifunctional epoxy compound 12kg
[0050] Sodium hydroxide solution 1.0kg
[0051] The preparation method of the adhesive described in this embodiment is the same as that in Example 1.
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