Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

HOT PLUG DEVICE FOR PLC backboard

A hot-swap, backplane technology, applied in the field of PLC backplane, can solve the problems of normal operation, inability to communicate, and the reliability of the PLC system is greatly affected, and achieve the effect of improving reliability.

Inactive Publication Date: 2019-08-06
LSIS CO LTD
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] At this time, if any one of the plurality of expansion modules connected via the serial backplane bus 30 (for example, the second expansion module 20b) is removed or an internal problem occurs, there is a possibility that communication cannot be performed.
[0011] As mentioned above, if the second expansion module 20b fails to communicate, the first expansion module 20a accepts the command of the backplane main unit 12 and processes it, and then passes through the serial backplane bus 30 to the next second expansion module 20b. The command of the backplane main unit 12 is transmitted, but the second expansion module 20b will not accept the command of the backplane main unit 12
[0012] At the same time, even if the third expansion module 20c in the next stage of the second expansion module 20b can communicate without any problem, it cannot receive commands from the backplane main unit 12 from the second expansion module 20b, resulting in failure to operate normally.
[0013] As mentioned above, if any of the expansion modules connected to the serial backplane bus 30 composed of one bus fails to communicate, the serial backplane bus 30 cannot communicate, so that the communication through the backplane will occur. The problem that the entire PLC system connected to the bus 30 cannot communicate
This problem has a great impact on the reliability of the PLC system

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • HOT PLUG DEVICE FOR PLC backboard
  • HOT PLUG DEVICE FOR PLC backboard
  • HOT PLUG DEVICE FOR PLC backboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] The above objects, features and advantages will be described in detail below with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains can easily carry out the technical idea of ​​the present invention. In the description of the embodiments of the present invention, if it is judged that the detailed description of the known technology associated with the present invention unnecessarily obscures the essence of the present invention, the detailed description of the known technology will be omitted. Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Throughout the drawings, the same reference numerals designate the same or similar parts.

[0048] Below, will refer to Figure 3 to Figure 5 The hot-swap device of the Ethernet-based PLC backplane according to some embodiments of the present invention is described. It should be noted that, in ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a hot plug device for a serial backboard, which enables a backboard bus to communicate even if an expansion module fails during communication between a backboard master unit and a backboard slave unit by using a backboard design technique. The hot plug device of the PLC backboard comprises a CPU module used for transmitting an operation command; the at least one expansion module is used for receiving and processing the operation command; the backboard bus is connected to the bus and used for communication between the CPU module and the expansion module; and atleast one backboard module connected to the backboard bus and implemented in a detachable manner that is physically separable from the plurality of extension modules, respectively.

Description

technical field [0001] The present invention relates to a PLC (Programmable Logic Controller, Programmable Logic Controller) backplane (Backplane), in particular, to a hot swap device for an Ethernet-based serial (serial) backplane. Background technique [0002] Backplane technology is a basic technology used to efficiently connect multiple modules to a bus system. [0003] The backplane of a traditional PLC system is used as a data bus to share the data of multiple modules. Even now, the performance of the backplane still determines the overall performance of the system and is an important technology to ensure reliability in data exchange. [0004] figure 1 is a block diagram showing a conventional backplane-based PLC system. [0005] Such as figure 1 As shown, the PLC system based on the backplane includes: a CPU module 10, a backplane master unit 12 is arranged inside the MPU11; a plurality of expansion modules 20a, 20b, 20c, and a backplane slave unit 22 is arranged i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G05B19/05
CPCG05B19/054G05B2219/1109G05B19/0423G05B2219/15078G05B2219/15119G05B2219/25464G06F13/4081G06F13/409G05B9/03G05B19/05G05B2219/1131G05B19/041G05B19/042
Inventor 李建昊
Owner LSIS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products