A substrate-integrated low passive intermodulation waveguide flange gasket

A passive intermodulation and waveguide flange technology, which is applied to waveguide-type devices, circuits, electrical components, etc., can solve the problems of inability to achieve electromagnetic band gap characteristics, inability to arrange metal convex body units, and difficulty in achieving small size and light weight. Achieve the effect of achieving low passive intermodulation performance, realizing small and thinning, and reducing the requirements of traditional waveguide flange surface treatment process and assembly process

Active Publication Date: 2021-07-13
XIAN INSTITUE OF SPACE RADIO TECH
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

However, the device proposed in this patent is limited in low-frequency applications, because as the frequency decreases, the size of the periodic metal convex structure increases accordingly. The conventional standard waveguide flange area is limited, and a sufficient number of metal convex units cannot be arranged. Realize the expected electromagnetic bandgap characteristics and affect the normal transmission of electromagnetic waves
And this patented structure is difficult to achieve small size and light weight

Method used

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  • A substrate-integrated low passive intermodulation waveguide flange gasket
  • A substrate-integrated low passive intermodulation waveguide flange gasket
  • A substrate-integrated low passive intermodulation waveguide flange gasket

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Embodiment Construction

[0036] The specific embodiment of the present invention is described in further detail below in conjunction with accompanying drawing:

[0037]The invention proposes a substrate-integrated low-passive-intermodulation waveguide flange gasket. By constructing a substrate-integrated double-sided periodic metal unit array, combined with an outer support structure, a double-sided gasket is formed between traditional waveguide flanges. Metal-free contact transition connection structure with air or medium gap. Determine the key structural size parameters through specific steps, obtain suitable electromagnetic band gap characteristics, ensure the normal transmission of the electromagnetic field along the waveguide, and cannot leak from the air or medium gap, and then replace the metal surface contact of the traditional waveguide flange connection, greatly eliminating the metal contact Non-linear for low passive intermodulation performance. The gasket structure proposed in the present...

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Abstract

A substrate-integrated low passive intermodulation waveguide flange gasket, by constructing a substrate-integrated double-sided periodic metal unit array, combined with an outer support structure, forms a double-sided metal-free spacer between traditional waveguide flanges The contact transition connection structure determines the key structural dimensions through specific steps, obtains suitable electromagnetic bandgap characteristics, and ensures the normal transmission of the electromagnetic field along the waveguide without leakage, thereby replacing the metal surface contact of the traditional waveguide flange connection, which greatly eliminates the metal contact Linear for low passive intermodulation performance. The gasket structure proposed in the present invention can realize low passive intermodulation transition connection without changing the original waveguide flange structure, and can realize miniaturization, lightness and high flexibility through the substrate integration method, and is uniform in the range from low frequency to high frequency. Dimensional matching to standard waveguide flange faces can be achieved. It can realize low-cost, general-purpose mass production, and can be applied to various high-power microwave components, systems and test systems with low passive intermodulation requirements.

Description

technical field [0001] The invention relates to a waveguide flange gasket and belongs to the field of microwave technology. Background technique [0002] Passive Intermodulation (PIM) effect is an important interference phenomenon in communication systems, which widely exists in various high-power microwave passive components and connection structures. In order to ensure the normal operation of the communication system, it is necessary to take effective passive intermodulation suppression measures. The main mechanism of passive intermodulation is contact nonlinearity and material nonlinearity. Material nonlinearity can be avoided by choosing appropriate materials, while contact nonlinearity generally exists in various microwave passive structures. The waveguide structure is one of the most widely used structural forms in various high-power microwave systems, and the waveguide flange connection is the primary factor for passive intermodulation in the waveguide structure. Cur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/00H01P1/06
CPCH01P1/00H01P1/06
Inventor 陈翔孙冬全崔万照双龙龙贺永宁周强胡少光
Owner XIAN INSTITUE OF SPACE RADIO TECH
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