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Novel magnetron sputtering device

A magnetron sputtering device and a new technology, applied in sputtering coating, ion implantation coating, metal material coating process, etc., can solve the problem of uneven distribution, low coating quality and coating efficiency, and poor target utilization. equality issues

Inactive Publication Date: 2019-07-05
LAKESIDE PHOTOELECTRONICS TECH JIANGSU CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The internal magnetic field of the existing magnetron sputtering equipment cannot be changed and the distribution is uneven, which makes the use of the target uneven, and the coating quality and coating efficiency are not high

Method used

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  • Novel magnetron sputtering device
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  • Novel magnetron sputtering device

Examples

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Embodiment Construction

[0013] Such as figure 1 and figure 2 As shown, a novel magnetron sputtering device of the present invention includes a sputtering chamber and a solenoid 2, and a substrate 1 is fixed on the upper end of the sputtering chamber. A target 3 is arranged in the sputtering chamber, and the solenoids 2 are evenly distributed on the back of the target 1 and the bottom of the sputtering chamber, and each solenoid 2 is electrically connected to a power source. Such as image 3 As shown, each solenoid 2 can be energized separately to form an electromagnetic rod. The magnetic field distribution of the entire sputtering chamber can be controlled by adjusting the energization of each solenoid. A target inclination angle adjustment device is connected to the back of the target. In this embodiment, the target inclination angle adjustment device is a telescopic rod 4 connected to the lower end of the target back.

[0014] Such as figure 2 As shown, based on this, different materials can...

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Abstract

The invention relates to the technical field of magnetron sputtering equipment, in particular to a novel magnetron sputtering device. The device comprises a sputtering chamber and solenoids; target materials are arranged on the left side and the right side of the sputtering chamber, the solenoids are uniformly distributed at the back of the target material and the bottom of the sputtering chamber,all the solenoids are electrically connected with a power supply; and the back of the target materials are connected with target material inclination angle adjusting devices. According to the device,by the adoption of the structure, the two target materials can be mixed and used, a novel target material can be created, the coating quality is improved; in addition, compared with existing sputtering equipment, the utilization rate of the target materials can be greatly improved by adjusting an internal magnetic field.

Description

technical field [0001] The invention relates to the technical field of magnetron sputtering equipment, in particular to a novel magnetron sputtering device. Background technique [0002] The internal magnetic field of the existing magnetron sputtering equipment cannot be changed and the distribution is uneven, which makes the use of the target uneven, and the coating quality and coating efficiency are not high. [0003] Chinese invention patent CN 107794496 A discloses a magnetron sputtering coating device and a magnetron sputtering coating method, wherein the magnetron sputtering coating device includes: a solenoid for generating a magnetic field; and a target, the target At least a part of is in use located in the solenoid and is used to sputter material of the target onto the surface of the object. The magnetron sputtering coating method includes: providing a solenoid for generating a magnetic field; inserting a tube whose inner surface requires sputter coating into the ...

Claims

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Application Information

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IPC IPC(8): C23C14/35C23C14/54
CPCC23C14/352C23C14/54
Inventor 褚天舒
Owner LAKESIDE PHOTOELECTRONICS TECH JIANGSU CO
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