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imaging device

An imaging device and image sensor technology, which is applied in the field of photography, can solve problems such as increased power, unstable picture quality, and affecting the service life of mobile phone cameras, so as to achieve the effect of increasing service life and improving shooting quality

Active Publication Date: 2021-06-01
TRIPLE WIN TECHSHENZHEN CO LTD +1
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0003] However, with the gradual increase in the performance of the camera module, the power it uses is also increasing. During long-term operation, the power-on device will continue to generate heat, and the picture quality of the mobile phone camera working under high temperature is unstable. It will affect the service life of the mobile phone camera

Method used

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Embodiment Construction

[0025] The imaging device 100 provided by the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0026] see Figure 1 to Figure 4 , the present invention provides an imaging device 100 , which includes: a circuit board 10 , a supporting base 20 and a camera module 30 .

[0027] see figure 2 , the circuit board 10 may be a flexible circuit board, a rigid-flex composite board or a ceramic substrate. An image sensor 12 , a grounding conductive pad 14 and a plurality of electronic components 16 located around the image sensor 12 are disposed on the circuit board 10 . The electronic component 16 can be an electronic component for improving the performance of the image sensor 12 , such as a resistor, a capacitor, and the like.

[0028] In this embodiment, the circuit board 10 is square. The number of the grounding conductive pads 14 is two, which are respectively distributed at the edge positions of oppos...

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Abstract

The present invention relates to an imaging device, which comprises: a circuit board, a support base arranged on the circuit board, and a camera module set on the support base, an image sensor is arranged on the circuit board, An accommodating space is formed on the support base, and the image sensor is located in the accommodating space. The feature is that the support base is recessed with a plurality of first receiving parts at intervals, and each first receiving part holds a As for the heat dissipation components, one surface of each heat dissipation component is exposed in the accommodating space, and the other surface is exposed outside the support base.

Description

technical field [0001] The invention relates to the technical field of imaging, in particular to an imaging device capable of better heat dissipation. Background technique [0002] With the multi-functional development of electronic products, camera modules are widely used in consumer electronic products such as mobile phones, notebook computers, and personal digital assistants. While pursuing multi-functionality, people also hope that electronic products have excellent image effects, that is, they hope that camera modules have high image quality. [0003] However, with the gradual increase in the performance of the camera module, the power it uses is also increasing. During long-term operation, the power-on device will continue to generate heat, and the picture quality of the mobile phone camera working under high temperature is unstable. It will affect the service life of the mobile phone camera. Therefore, it is necessary to provide an imaging device that can overcome t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03B17/55H04N5/225G03B30/00
CPCG03B17/55H04N23/52H04N23/54
Inventor 马晓梅陈信文丁盛杰
Owner TRIPLE WIN TECHSHENZHEN CO LTD
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