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A computer host placing device capable of efficiently dissipating heat

A computer mainframe, high-efficiency technology, applied in the direction of electrical digital data processing, digital processing power distribution, instruments, etc., can solve problems such as slow running speed, blue screen of death, burned out motherboard, etc., achieve smooth and efficient use, wide blowing area, Uniform effect on the wind surface

Inactive Publication Date: 2019-06-25
董峰娟
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the application of computers is becoming more and more popular. People rely more and more on computers in their lives and work, and have higher and higher requirements for the performance of computers. However, the speed of many computers is not satisfactory. The key points that affect the performance of the computer are not only its own hardware configuration, but also the overall environment of the computer. During the operation of the computer, it will generate heat. However, the current computer case is often unable to remove the heat in time, resulting in the computer running in a high temperature environment. Ultimately it will lead to slow running speed, unresponsive opening of the program or frequent blue screen of death, sudden shutdown and failure to start, burning out the motherboard or CPU, and even directly shortening the service life of the computer. Therefore, an efficient cooling system is urgently needed. placement device for host computer

Method used

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  • A computer host placing device capable of efficiently dissipating heat
  • A computer host placing device capable of efficiently dissipating heat
  • A computer host placing device capable of efficiently dissipating heat

Examples

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Embodiment Construction

[0015] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0016] See Figure 1-3 , The present invention provides a technical solution: an efficient heat dissipation device for placing a computer mainframe, comprising a casing 1, a control panel 2 is arranged on the top of the casing 1, and the control panel 2 is placed on the upper part of the casing, so that during use The user can decide whether to turn on the high-efficiency heat dissipation device according to the overall situation. The bo...

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PUM

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Abstract

The invention discloses a computer host placing device capable of efficiently dissipating heat. The device comprises a shell, a control panel is arranged at the top of the shell, ventilation holes areformed in the left side face of the shell, a storage battery is fixedly connected to the bottom of the inner wall of the shell, the front face of the shell is hinged to a cover plate through hinges,and a handle is fixedly installed on the front face of the cover plate. According to the invention, through cooperation between a first motor, a second motor, a third motor, a first blade, a second blade and a cam, the purposes of ventilation and heat dissipation are achieved; by use of the advantages of flexible movement and wide blowing area of the heat dissipation fan, air receiving fan of thecase body is quite uniform, and it is sufficiently ensured that the heat is blown away by outside cold air in time after the case body is heated, it is guaranteed that efficient and timely heat dissipation of the case body is achieved due to the fact that the reasonable ventilation holes are formed in the device, and a computer is used more smoothly and efficiently in life and work.

Description

Technical field [0001] The invention relates to the technical field of intelligent equipment, in particular to a computer host placement device with efficient heat dissipation. Background technique [0002] At present, the application of computers is becoming more and more popular. People are becoming more and more dependent on computers in their lives and work, and they have higher and higher requirements for computer performance. However, the speed of many computers is very unsatisfactory. In addition to its own hardware configuration, the key point that affects computer performance is the overall computer operating environment. The computer itself generates heat during operation. However, current computer cases often cannot be removed in time due to heat, which causes the computer to operate in a high temperature environment. Eventually results in slow running speed, slow response to opening programs, or frequent blue screen crashes. Sudden shutdowns may not start, the motherb...

Claims

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Application Information

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IPC IPC(8): G06F1/18G06F1/20
Inventor 董峰娟
Owner 董峰娟
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