A computer host placing device capable of efficiently dissipating heat
A computer mainframe, high-efficiency technology, applied in the direction of electrical digital data processing, digital processing power distribution, instruments, etc., can solve problems such as slow running speed, blue screen of death, burned out motherboard, etc., achieve smooth and efficient use, wide blowing area, Uniform effect on the wind surface
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[0015] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0016] See Figure 1-3 , The present invention provides a technical solution: an efficient heat dissipation device for placing a computer mainframe, comprising a casing 1, a control panel 2 is arranged on the top of the casing 1, and the control panel 2 is placed on the upper part of the casing, so that during use The user can decide whether to turn on the high-efficiency heat dissipation device according to the overall situation. The bo...
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