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Array substrate and manufacturing method thereof, display device and imaging method thereof

An array substrate and imaging technology, applied in radiation control devices, image communications, televisions, etc., can solve problems such as high cost of mechanical structures, unfavorable development of narrow bezels and full screens, and lack of screen-to-body ratio, so as to improve the clarity of shooting degree of effect

Active Publication Date: 2021-10-08
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the screen-to-body ratio problem has never been able to find a better solution
For example, some manufacturers have proposed lifting and pop-up cameras, but these solutions inevitably have many problems such as high cost of mechanical structure and dustproof lens.
[0003] In the prior art, the front camera device is usually set at the frame position of the display device, which is not conducive to the development of narrow frame and full screen

Method used

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  • Array substrate and manufacturing method thereof, display device and imaging method thereof
  • Array substrate and manufacturing method thereof, display device and imaging method thereof
  • Array substrate and manufacturing method thereof, display device and imaging method thereof

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Embodiment Construction

[0046] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the relevant disclosure, not to limit the disclosure. It should also be noted that, for the convenience of description, only the parts related to the disclosure are shown in the drawings.

[0047] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0048] The front camera device may usually be set at the frame position of the display device. Due to the structural requirements of the camera device itself, it needs to occupy a certain space, which limits the expansion of the display screen. The existence of the front camera device...

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Abstract

The application discloses an array substrate and a preparation method thereof, a display device and an imaging method thereof. The array substrate includes: a base substrate; a plurality of imaging apertures and sensor units arranged above the base substrate, wherein the imaging apertures are located above the sensor units, and each imaging aperture is in one-to-one correspondence with each sensor unit . According to the technical solution of the embodiment of the present application, by adding an imaging pinhole layer and an image forming layer, the camera function is integrated in the display screen, which avoids occupying the frame position of the display device, and is conducive to realizing a narrow frame and a full screen.

Description

technical field [0001] The present application generally relates to the field of display technology, and in particular relates to an array substrate and a manufacturing method thereof, a display device and an imaging method thereof. Background technique [0002] With the rapid development of smart terminals, users have put forward requirements such as narrow borders and full screens for the display interface of terminal equipment. However, there has been no better solution to the screen-to-body ratio problem. For example, some manufacturers have proposed lift-type and pop-up cameras, but these solutions inevitably have many problems such as high mechanical structure costs and dust-proof lenses. [0003] In the prior art, the front camera device is usually arranged at the frame position of the display device, which is not conducive to the development of narrow frame and full screen. Contents of the invention [0004] In view of the above-mentioned defects or deficiencies ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146H04N5/225H04N5/232
CPCH01L27/146H04N23/45H04N23/57H04N23/60H10K59/65H10K59/121H10K59/12H10K59/122H10K59/124H10K59/126H10K71/00H10K59/1201
Inventor 邱海军何月娣唐国强张振华
Owner BOE TECH GRP CO LTD
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