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Printing preparation method for thermal resistor

A technology of thermistor and printed resistance, applied in the field of electronics, can solve the problems of large occupied volume and large thickness of thermistor, and achieve high precision and good effect.

Inactive Publication Date: 2019-05-21
广西桂仪科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for printing and preparing thermistors, which solves the technical problems of large thickness and large occupied volume of negative temperature coefficient thermistors

Method used

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  • Printing preparation method for thermal resistor
  • Printing preparation method for thermal resistor

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Embodiment Construction

[0037] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below with reference to the accompanying drawings and preferred embodiments. However, it should be noted that many of the details listed in the specification are only for readers to have a thorough understanding of one or more aspects of the present invention, and these aspects of the present invention can be implemented even without these specific details.

[0038] Such as figure 1 As shown, it includes a protective layer 1, a printed thermistor 2 and an electrode 3. According to a schematic structural diagram of a method for printing and preparing a thermistor according to the present invention, the method includes the following steps:

[0039] Step 1: Obtain the required resistance value of the thermistor, and design the volume size of the thermistor according to the square resistance of the resistive material and...

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Abstract

The invention discloses a printing preparation method for a thermal resistor, belonging to the technical field of electronics. The method comprises steps of acquiring a desired resistance value of a thermal resistor, and designing a volume of the thermal resistor according to a sheet resistance of a resistor material and the desired resistance value; removing dust in an area where a thermal resistor is to be printed on a thermal conductive insulating layer, and printing the resistor material on the thermal conductive insulating layer by using a screen printing technology; after printing, putting the thermal conductive insulating layer in a sintering furnace for sintering; after sintering and shaping, measuring the shaped thermal resistor, correcting the sintered and shaped thermal resistor. The length and width of a corresponding printed thermal resistor are designed according to desired resistance value, so that thermal resistors can be designed according to different user demands. The prepared thermal resistors are more accurate and have better effects, further, the printed thermal resistor is only 0.1-0.2mm thick, while traditional chip resistor is more than 1mm thick, therefore, the prepared thermal resistor has innovative progress in thickness and better meets demands of modern microelectronics.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a method for preparing a thermistor by printing. Background technique [0002] Thermistors are a type of sensitive components, which are divided into positive temperature coefficient thermistors (PTC) and negative temperature coefficient thermistors (NTC) according to different temperature coefficients. A typical feature of a thermistor is that it is sensitive to temperature and exhibits different resistance values ​​at different temperatures. The positive temperature coefficient thermistor (PTC) has a larger resistance value when the temperature is higher, and the negative temperature coefficient thermistor (NTC) has a lower resistance value when the temperature is higher. They both belong to semiconductor devices. [0003] The existing negative temperature coefficient thermistors basically use chip negative temperature coefficient thermistors. Since the thickness of the ne...

Claims

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Application Information

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IPC IPC(8): H01C17/065H01C7/04H01C17/242
Inventor 黄耀
Owner 广西桂仪科技有限公司
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