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A method for dynamically adjusting test conditions in a wafer test process

A technology of wafer testing and dynamic adjustment, applied in static memory, instruments, etc., can solve problems such as test quality differences and wafer manufacturing process differences, and achieve the effect of improving yield, saving costs, and ensuring quality and reliability.

Active Publication Date: 2019-05-10
XI AN UNIIC SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem of test quality differences caused by wafer manufacturing process differences, the purpose of the present invention is to provide a method for dynamically adjusting test conditions during wafer testing, which saves packaging costs and improves back-end Test yield

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  • A method for dynamically adjusting test conditions in a wafer test process
  • A method for dynamically adjusting test conditions in a wafer test process

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Embodiment Construction

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

[0028] In order to make the object, technical solution and advantages of the present invention more clear, the specific implementation of the present invention will be further described below in conjunction with the drawings and embodiments, which are explanations of the present invention rather than limitations.

[0029] In order to solve the problem of test quality differences caused by differences in wafer manufacturing process, a method of dynamically adjusting test conditions during wafer testing is introduced in wafer-level testing, such as...

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Abstract

The invention discloses a method for dynamically adjusting a test condition in a wafer test process. The method comprises the following steps: S100, starting testing of a wafer; S200, monitoring the operation of the test item, and pre-judging the yield of the current tested wafer by using the test result of the monitoring test item: if the yield of the current tested wafer is pre-judged to be qualified according to the result of the monitoring test item, carrying out the step S300 according to the first group of test parameters; if it is prejudged that the yield of the current tested wafer isunqualified, a step S300 is carried out according to a second group of test parameters; S300, executing the conventional test items of the wafer in sequence; S400, ending the test. According to the method, the packaging cost is saved, and the yield of the back-end test is improved.

Description

technical field [0001] The invention belongs to the technical field of memory wafer manufacturing and relates to a method for dynamically adjusting test conditions during wafer testing. Background technique [0002] In the existing wafer test, once the test program is released, the key parameters of each test item are fixed and cannot be modified. The test process is as follows: figure 1 shown. [0003] As the DRAM manufacturing process becomes smaller and smaller, different wafers in the same batch and wafers in different batches will have process differences during the manufacturing process, which will lead to quality differences between wafers. An obvious trend on the test side is that among the wafers tested by the same version of the test program, wafers with large process errors often result in a large number of unqualified chips being judged as qualified. These unqualified chips entering the packaging process and back-end testing process will increase the cost of c...

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Application Information

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IPC IPC(8): G11C29/00
Inventor 王帆黄华史丽君
Owner XI AN UNIIC SEMICON CO LTD
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