Asynchronous die-cutting method with small holes in place and asynchronous die-cut products with small holes in place

Abstract

The invention discloses a micropore looping asynchronous die cutting method and a micropore looping asynchronous die cutting product. The micropore looping asynchronous die cutting method comprises the following steps:S1, successively laminating a main material and a first release film on a first bottom film, and transferring to a first knife die; S2, prior to entering the first cutting die, removing the first bottom film below the main material, and transferring a first protective film to the first cutting die below the main material; S3, punching the first release film by virtue of the firstcutting die, and laminating the first protective film below the main material to form a first composite film; S4, removing the first release film on the punched first composite film and coating witha second release film, laminating a second bottom film below the first protective film to form a second composite film, and transferring the second composite film to a second cutting die;and S5, performing the looping cutting for the second composite film by virtue of a second cutting die, and die cutting a finished product by looping cutting the second composite film. By adopting the micropore looping asynchronous die cutting method, the utilization rate of the main material is increased, the procedures are reduced, the efficiency is increased, and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of die-cutting, in particular to an asynchronous die-cutting method with a small hole in place and an asynchronous die-cut product with a small hole in place. Background technique [0002] With the rapid upgrading of mobile phones, tablets, computers and other electronic products on the market, users are pursuing low cost and high quality, and the requirements for the production process of electronic products are becoming increasingly demanding. In order to meet the needs of users for low cost, the cost reduction and efficiency increase of die-cutting products are also becoming more and more normalized. [0003] At present, the conventional die-cutting method in the die-cutting process is to bond the substrate and the main material, or to bond the release film to the main material, and then punch through the knife die or punch multiple small holes to remove excess. The waste materials are obtained to obtain...

AI Technical Summary

Problems solved by technology

[0004] In the current die-cutting process, the die-cutting products have a large typesetting gap and the utilization rate of the main material is low. During the waste discharge process, due to the stickiness of the double-sided adhesive, some products will be discharged together with the waste.

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