Method for manufacturing micro-perforated plate
A technology of micro-perforated plate and round hole, which is applied in building components, sound insulation, building structure, etc., can solve the problems of low production efficiency, difficult realization, and cost increase, and achieves low price, suitable for processing, and convenient installation. Effect
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Embodiment 1
[0039] A method for manufacturing a micro-perforated plate, utilizing the heat-shrinkable property of the heat-shrinkable plate 1, processing millimeter-level holes on the heat-shrinkable plate, and making holes of the silk-meter level or below through heat-shrinkage.
[0040] In this embodiment, the heat-shrinkable plate is a PVC plate with a shrinkage ratio of 60%, and a circular hole 2 with a diameter of 2 mm is machined on a PVC plate with a thickness of 0.1 mm (see figure 1 ). The processed millimeter-scale holes are evenly distributed.
[0041] Millimeter-scale holes were processed on the heat-shrinkable plate at a temperature of 25° C., and the heat-shrinkable plate was heated in an oven at 160° C. until it shrank naturally, taken out and cooled, and a transparent PVC plate with a thickness of 3 mm was obtained. There are 0.2mm diameter holes on the board ( figure 2 ).
Embodiment 2
[0043] The processing method of this embodiment is the same as that of Embodiment 1, and the heat-shrinkable board is an opaque PVC board with a thickness of 2mm.
[0044] Triangular holes with a side length of 2 mm and elliptical holes with a major axis of 3 mm are processed by laser technology, and the holes are arranged to be non-uniformly distributed.
[0045]Then, heat the heat-shrinkable plate in an oven at 160° C., so that the heat-shrinkable plate naturally shrinks to obtain holes of silk rice level or below. The thickness of the plate becomes 20mm, and the size of the hole on the plate is 0.2mm-0.3mm.
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