Full-automatic double-track glue dispensing machine and glue dispensing process thereof

Abstract

The invention discloses a full-automatic double-track glue dispensing machine and a glue dispensing process thereof. The full-automatic double-track glue dispensing machine comprises a material box feeding mechanism, two conveying tracks, a glue dispensing platform and a glue dispensing assembly. The two conveying tracks are arranged in parallel in the straight line direction in a spaced mode. Thematerial box feeding mechanism is arranged at the ends of the two conveying tracks in the direction perpendicular to the conveying tracks. A material box assembly is arranged on the side portion of the front end of a transfer member. At least two material boxes are placed in the material box assembly. The glue dispensing platform is arranged in the conveying tracks. The glue dispensing assembly is arranged above the glue dispensing platform. Independent conveying of carrier boards is achieved, and the functions of clamping the boxes, distributing materials to the conveying tracks, pushing thecarrier boards to the conveying tracks and the like are simultaneously completed; frictional collision between the adjacent carrier boards is effectively avoided; and through a linear pushing mode, the positional stability of fingerprint modules on the carrier boards is ensured while the feeding and discharging efficiency is improved.

Description

technical field [0001] The invention relates to the field of mechanical automation, in particular to a fully automatic double-track glue dispensing machine and a glue dispensing process thereof. Background technique [0002] In recent years, smart phone technology has developed rapidly, and various new technologies have been continuously applied in the manufacturing process of smart phones, such as the fingerprint recognition boot technology that appears in domestic mobile phones. The hardware and software foundation of fingerprint recognition technology is fingerprint modules. In the process of mobile phone production and assembly, the bottom of the FPC+IC product for the fingerprint module needs to be filled with glue, so that the FPC+IC of the fingerprint module can be fixed on the carrier board; in the process of solving the problem of fingerprint module dispensing automation and productivity improvement Among them, there are the following key technical problems that nee...

AI Technical Summary

Problems solved by technology

[0002] In recent years, smart phone technology has developed rapidly, and various new technologies have been continuously applied in the manufacturing process of smart phones, such as the fingerprint recognition boot technology that appears in domestic mobile phones. The hardware and software foundation of fingerprint recognition technology is fingerprint modules. In the process of mobile phone production and assembly, the bottom of the FPC+IC product for the fingerprint module needs to be filled with glue, so that the FPC+IC of the fingerprint module can be fixed on the carrier board; in the process of solving the problem of fingerprint module dispensing automation and productivity improvement Among them, there are the following key technical problems that need to be solved: 1. Since modern industrial production mostly adopts the automatic production line mode, this production mode can complete the processing of various processes for the continuous flow of concentrated and large-scale products, while the existing loading method of the carrier board Generally, a manipulator is used to move the carrier board out or put it into the material box. In this loading method, the carrier board is directly stacked in the material box, and the adjacent carrier boards will wear and collide with each other during storage and transportation, resulting in Or the fingerprint module is damaged, especially for the fingerprint module before dispensing, it is placed on the carrier board, but it is not fixed with the carrier board, so it is very easy to shift the position of the fingerprint module on the carrier board during the removal process , which affects the assembly accuracy; 2. When the traditional manipulator loads the carrier board by adsorption or clamping, the path of the carrier board is to rise along the vertical direction first, then move along the horizontal linear direction, and then move along the vertical direction The moving path of the carrier board is long, which limits the improvement of the feeding efficiency of the carrier board, and the position of the fingerprint module is likely to shift during the lifting process of the carrier board, resulting in an increase in the rate of defective products in assembly; 3. In addition, the traditional stand-alone The dispensing process can only complete the dispensing action of one carrier board at a time, and the dispensing efficiency is low. In order to improve the dispensing efficiency, the method that can be adopted is to adopt a double dispensing or multi dispensing process, and each glue gun can be dispensing simultaneously and independently; But before dispensing, how to send the carrier board to the dispensing station independently and quickly is the core problem of realizing this kind of double dispensing or multi dispensing

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