A slider bonding process equipment and bonding method

Abstract

The invention discloses sliding block bonding process equipment and a bonding method. The equipment comprises an arch clam, a first ejection block, a second ejection block, a third ejection block, a fourth ejection block, a positioning pin, a movable handle compression screw and a movable handle; a threaded hole is formed in one end of the arch clamp, and the movable handle compression screw is installed on the arch clamp through the threaded hole; a groove is formed in the other end of the arch clamp, the second ejection block is installed in the groove of the arch clamp and is welded and formed; threads and a mounting hole are formed in the movable handle compression screw, and the fourth ejection block is connected to the movable handle compression screw through the threads; the movablehandle penetrates through the mounting hole to be connected to the movable handle compression screw; the first ejection block and the second ejection block are located and connected through the positioning pin; and the third ejection block is welded to the other end of the arch clamp and is arranged in parallel with the fourth ejection block. According to the bonding process equipment and the bonding method, the equipment is located positioned through the arch clamp and the ejection blocks, and the movable handle compression screw is used for applying force and clamping, so that a product isbonded and fixedly formed with a product copper groove.

Description

technical field [0001] The invention belongs to the field of bonding technology, and in particular relates to a slider bonding process equipment and a bonding method. Background technique [0002] The slider of a certain product needs to be bonded and fixed with copper grooves. [0003] In the current traditional solution, a single bonding device can only be adapted to the bonding work of a slider of a single size, and the adaptability and versatility are not high, and the production cost is relatively high. Especially in the case of heavy production tasks, a large number of sliders on a certain product need to be bonded. Due to the non-uniform size, the traditional bonding method cannot achieve adaptability and versatility, and cannot guarantee the bonding time. The copper grooves on each surface are evenly stressed, resulting in uneven thickness of the copper grooves after bonding and making them unusable. Contents of the invention [0004] The technical problem solved...

AI Technical Summary

Problems solved by technology

[0003] In the current traditional scheme, a single bonding device can only adapt to the bonding work of a single-sized slider, which is not high in adaptability and versatility, and the production cost is high

Especially in the case of heavy production tasks, a large number of sliders on a certain product need to be bonded. Due to the non-uniform size, the traditional bonding method cannot achieve adaptability and versatility, and cannot guarantee the bonding time. The copper grooves on each surface are evenly stressed, resulting in uneven thickness of the copper grooves after bonding and cannot be used

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