Thimble anti-collision structure and ejector module

Abstract

The invention relates to a thimble anti-collision structure and a thimble module. Wherein, the thimble anti-collision structure includes a conductive cylinder capable of inserting a thimble and a conductive ring sleeved on the periphery of the conductive cylinder. An elastic support is provided on the outer periphery of the conductive cylinder, and one end of the elastic support is connected to the conductive cylinder. , the other end of the elastic support is connected to the conductive ring. When working normally, the conductive cylinder and the conductive ring are arranged at intervals, and the two are in a power-off state. When an external object hits, the The conductive ring moves relative to the conductive cylinder, the conductive ring is in contact with the conductive cylinder, and the controller controls the emergency stop of the workbench or the downward movement of the thimble module according to the signal that the conductive ring and the conductive cylinder are in contact with each other to prevent the thimble module from Crashed situations happen.

Description

technical field [0001] The invention relates to the field of semiconductor rear packaging, in particular to a thimble anti-collision structure and a thimble module. Background technique [0002] In the semiconductor manufacturing process, the crystal grains formed by deposition, sputtering, and etching processes need subsequent packaging to protect the internal structure and prevent external impurities from entering and affecting performance. In the process of semiconductor post-packaging, it is necessary to realize the crystal extraction process through the thimble module. Specifically, when the blue film of the wafer is expanded, the thimble of the thimble module lifts the wafer up, and the corresponding suction nozzle absorbs the wafer to complete the crystal removal process. In the process of crystal extraction, the thimble module only moves in the vertical direction to complete the wafer lifting process. The workbench moves on the horizontal plane to realize the corre...

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a thimble anti-collision structure and a thimble module for the problem that the thimble module is easy to be hit during the crystal extraction process and cause damage.

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