Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

A boring and milling method for high-precision semicircular hole group

A technology for boring and milling processing and semi-circular holes, which is applied in the field of boring and milling processing of high-precision semi-circular hole groups, can solve problems such as low survival rate of parts, achieve reasonable and stable contact stress, reduce the influence of chip breaking cutting deformation, and optimize rough and finish machining. effect of margin

Active Publication Date: 2020-09-22
XIAN FLIGHT SELF CONTROL INST OF AVIC
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem solved by the invention: In order to meet the processing requirements of high-precision semicircular hole groups in aviation electromechanical products, reduce the influence of chip breaking and cutting deformation caused by semicircular structures, improve product quality, shorten production cycle, and reduce production costs, solve the traditional processing method In order to solve the problem of low survival rate of lower parts, the present invention proposes a boring and milling method suitable for high-precision semicircular hole groups, so as to realize the boring and milling processing of such high-precision semicircular hole groups

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A boring and milling method for high-precision semicircular hole group
  • A boring and milling method for high-precision semicircular hole group

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The material of an output shaft part is 15-5PH stainless steel, and the diameter of the semicircular hole group is The diameter of the central hole intersecting it is Machining is carried out on a three-axis CNC machine tool, combined with the figure 1 As shown, the specific processing process is as follows:

[0033] 1) Rationally arrange the rough and finish machining processes. The whole process of rough, semi-finish and finish machining is followed by drilling, milling, boring and reaming. A heat treatment stress relief process is added between the drilling and milling processes and between the milling and boring processes.

[0034] 2) Optimize rough and finish machining allowance. Drilling holes for rough machining to Φ5mm, semi-finishing milling holes to Φ5.9mm, semi-finishing boring holes to Φ5.96mm, finishing reaming groups to final size

[0035] 3) Setting of cutting parameters for CNC machining. Combined with the cutting performance of 15-5PH stainless ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the field of machining and discloses a boring-milling machining method of a high-precision semicircular hole group. To meet machining requirements of the high-precision semicircular hole group in an aviation electromechanical product, reduce chip breaking cutting deformation caused by semicircular structures, improve the machining quality, reduce unnecessary rework, repairand rejection, solve the problem of a low part survive rate under a traditional machining method condition, machining of the high-precision semicircular hole group is achieved through the method comprising the following steps that (1) rough machining and finish machining procedures are reasonably arranged; (2) the rough machining allowance and the finish machining allowance are optimized; and (3)cutting machining parameters are set. Through machining according to the method, boring-milling machining of the high-precision semicircular hole group can be achieved, the product quality is improved, the production cycle is shortened, and the product cost is lowered.

Description

technical field [0001] The invention belongs to the field of mechanical processing, and relates to a boring and milling processing method for a high-precision semicircular hole group. Background technique [0002] The structure of high-precision semi-circular hole group is common in aviation electromechanical products. Due to the limitation of this type of structure, chip breaking cutting method is required in actual machining, and the tool is subjected to uneven force during cutting. At present, the traditional processing method is rough machining, drilling the bottom hole, boring or reaming and finishing the hole group to size. Or the dimensional accuracy is too poor, the survival rate of parts is low, and it is difficult to guarantee the delivery node of the product, which has become a major problem restricting the quality of this type of product. Contents of the invention [0003] The technical problem solved by the invention: In order to meet the processing requireme...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23P15/00
CPCB23P15/00
Inventor 耿卫庭许迎飞成武冬郭晓炜潘静李梦
Owner XIAN FLIGHT SELF CONTROL INST OF AVIC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com