Making method of PCB and PCB

Abstract

The invention discloses a making method of a PCB and a PCB, which relate to the technical field of printed circuit boards. The making method comprises the following steps: making plated through holesin the conductive bonding area of a first substrate; removing the metal layers on the hole walls of part of the plated through holes near one end of the conductive bonding area to obtain part of plated holes; filling part of the plated holes with an insulating material; and bonding a metal block to the conductive bonding area by a conductive bonding material. First, the through holes are plated, and then, the metal block is pressed by the conductive bonding material. Communication of the holes and the metal block is realized, and problems such as hole density reduction and loss of depth control drill bits caused by the making of large-aperture blind holes are avoided. Meanwhile, part of the metal layers on the hole walls of part of the plated through holes are removed, so that the area ofthe metal block contains both wall-plated through holes and non-through holes, and more design requirements can be met under the condition of guaranteeing the density of the holes.

Description

Technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a PCB and a PCB. Background technique [0002] There are mainly two schemes for PCBs with buried metal blocks or PCBs with metal bases made by conventional processes: Scheme 1, the metal blocks cannot be connected to adjacent circuit layers, and they are only bonded by thermally conductive bonding materials, which has limited heat dissipation and Can not achieve good grounding shielding performance. The second solution is to connect the metal block to the circuit layer through metalized through holes or blind holes on the buried metal block plate or metal substrate, and the through holes or blind holes must be drilled into the metal block. On the one hand, it is more difficult to drill holes in the metal block; on the other hand, if the metal block area needs to include both ground holes and signal holes, because the two depths are different,...

AI Technical Summary

Problems solved by technology

On the one hand, it is difficult to drill holes on the metal block; on the other hand, if the area of ​​the metal block is to include ground holes and signal holes at the same time, because the two depths are different, it can only be made by controlled depth drilling. They are all blind holes; blind hole electroplating has a limitation of thickness-to-diameter ratio. The diameter of blind holes that need to be electroplated should be at least larger than the drilling depth. The density of holes on this area is determined, and the density of holes directly affects the heat dissipation performance, grounding shielding performance, etc.

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