Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Distance compensation multiple-input-multiple-output array millimeter wave three-dimensional imaging device and method

A three-dimensional imaging, millimeter wave technology, applied in measurement devices, radio wave measurement systems, radio wave reflection/re-radiation, etc., can solve problems such as large differences in image quality, reduce hardware costs, and reduce system complexity. , the effect of improving the speed of image reconstruction

Active Publication Date: 2018-11-06
SHANDONG ACAD OF SCI INST OF AUTOMATION
View PDF6 Cites 20 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, the existing millimeter-wave 3D image reconstruction method for MIMO arrays needs to ignore the distance information related to the distance propagation loss in order to realize the linearization of the phase information of the exponential term of the echo signal and the constantization of the coefficient term, resulting in different The reconstructed image quality of the target object in the distance direction is quite different

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Distance compensation multiple-input-multiple-output array millimeter wave three-dimensional imaging device and method
  • Distance compensation multiple-input-multiple-output array millimeter wave three-dimensional imaging device and method
  • Distance compensation multiple-input-multiple-output array millimeter wave three-dimensional imaging device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] It should be pointed out that the following detailed description is exemplary and intended to provide further explanation to the present application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0053] It should be noted that the terminology used here is only for describing specific implementations, and is not intended to limit the exemplary implementations according to the present application. As used herein, unless the context clearly dictates otherwise, the singular is intended to include the plural, and it should also be understood that when the terms "comprising" and / or "comprising" are used in this specification, they mean There are features, steps, operations, means, components and / or combinations thereof.

[0054] In some typical implementations of the present application, a distance-compensated MIMO array millimeter-...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses a distance compensation multiple-input-multiple-output array millimeter wave three-dimensional imaging device and method. The device comprises a single-channel emitterwhich generates linear frequency modulation millimeter wave signals and transmits the linear frequency modulation millimeter wave signals to a two-dimensional antenna array and a multi-channel receiver; the two-dimensional antenna array comprises an emission antenna and a receiving antenna which are distributed in a two-dimensional plane mode, the emission antenna radiates millimeter wave signalsto a free space, and the receive antenna receives scattering echo signals of a target object; the multi-channel receiver comprises a plurality of same receiver channels, the receiver of each channel performs orthorhombic down-conversion processing of the linear frequency modulation millimeter wave signals from the single-channel emitter and the echo signals from the receive antenna to obtain amplitude signals and phase signals of the echo signals and transmit the amplitude signals and the phase signals to a data processing system; and the data processing system employs the amplitude signals and phase signals of the echo signals to achieve the image reconstruction of the target object through adoption of the distance compensation.

Description

technical field [0001] The invention relates to the technical field of millimeter wave imaging, in particular to a distance-compensated multi-input multi-output array millimeter-wave three-dimensional imaging device and method. Background technique [0002] Millimeter waves with a frequency in the range of 30GHz to 300GH are especially suitable for applications in human security inspection, non-destructive detection, medical diagnosis and other fields due to their excellent characteristics such as good penetration, high imaging resolution, and non-ionizing radiation. Related millimeter-wave 3D imaging devices and methods have become a current research hotspot. [0003] In order to reconstruct a 3D image of an object, a 2D antenna array is required. Antenna array topologies include single-base structures and multi-base structures. In the single-base structure, only a pair of transmitting antennas and receiving antennas in the same position work at the same time, and a two-d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01S13/89G01S7/42
CPCG01S7/42G01S13/89
Inventor 常天英王忠民崔洪亮
Owner SHANDONG ACAD OF SCI INST OF AUTOMATION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com