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Negative type photosensitive composition curable at low temperature

A photosensitive composition and technology of the composition are applied in the direction of photosensitive material processing, optics, opto-mechanical equipment, etc., to achieve the effect of excellent electrical insulation properties and cheap manufacturing

Active Publication Date: 2018-10-23
MERCK PATENT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the coating film formed from this composition is cured at a low temperature, there is a problem that unreacted acryloyl groups sometimes remain, and the acryloyl groups react with chemicals used in the manufacturing process of the device.

Method used

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  • Negative type photosensitive composition curable at low temperature
  • Negative type photosensitive composition curable at low temperature
  • Negative type photosensitive composition curable at low temperature

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0182]

[0183] Into a reaction container equipped with a stirrer, a thermometer, and a condenser, 32.5 g of a 25% by weight TMAH aqueous solution, 800 ml of isopropanol (IPA), and 2.0 g of water were added. Separately, 39.7 g of phenyltrimethoxysilane, 34.1 g of methyltrimethoxysilane, and 7.6 g of tetramethoxysilane were mixed to prepare a mixed solution, which was then placed in a dropping funnel. This mixed solution was added dropwise into the aforementioned reaction vessel at 10°C, and after stirring the obtained mixture at the same temperature for 3 hours, 10% HCl aqueous solution was added to neutralize the mixture, and then 400 ml of toluene was added to the neutralized mixture. The mixture was separated into two layers with 100 ml of water, the organic layer was collected, concentrated under reduced pressure to remove the solvent, and PGMEA was added to the concentrate so that the solid content concentration became 40% by weight.

[0184] When the molecular weight (...

Synthetic example 2

[0185]

[0186] Add the solvent shown in Table 2 to a reaction vessel equipped with a stirrer, a thermometer, a condenser, and a nitrogen inlet pipe, heat under a nitrogen atmosphere, and heat up to an appropriate temperature with the 10-hour half-life temperature of the initiator as a reference. . Separately, the monomers shown in Table 1 were mixed with the initiators shown in Table 2 to prepare a mixture, which was then added dropwise to the aforementioned solvent over 4 hours. Then, it reacted for 3 hours, and the resin solution of alkali-soluble resin A-H was prepared. The compounding quantity in a table|surface is shown by weight part.

[0187] Table 1

[0188]

[0189] Note:

[0190] AA: Acrylic,

[0191] MAA: methacrylic acid,

[0192] KBM-503 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.): γ-methacryloxypropyltrimethoxysilane,

[0193] KBM-502 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.): γ-methacryloxypropylmethyldimethoxysilane,

...

Embodiment 1

[0210] The solution of polysiloxane obtained in Synthesis Example 1 and the solution of alkali-soluble resin A and A' obtained in Synthesis Example 2 were carried out in a weight ratio of 3:3.5:3.5 in terms of solid content of the resin. mixed to obtain a polymer mixture. This polymer mixture was mixed with acrylic monomer A (tris(2-acryloyloxyethyl)isocyanurate), acrylic monomer B and acrylic monomer C in an amount of 10 parts by weight each. These monomers are represented by the following general formula and serve as (meth)acryloyloxy group-containing compounds. Then, add 3.0 parts by weight of Irgacure OXE-02 (radical generator A) as a photoradical generator and 0.3 parts by weight of KF-53 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) as a surfactant, and then add PGMEA made the concentration 35%, obtained the dissolution rate of Compositions. Here, the compounding ratio (parts by weight) of each component is based on 100 parts by weight of the total weigh...

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Abstract

The invention provides a negative type photosensitive composition curable at a low temperature and capable of forming a cured film excellent in transparency, in chemical resistance and in environmental durability, and also to provide a pattern-formation method employing the composition. The present invention provides a negative type photosensitive composition comprising : an alkali-soluble resin,a compound having two or more (meth)acryloyloxy groups, a polysiloxane, a polymerization initiator, and a solvent. The alkali-soluble resin is a polymer comprising a carboxyl-containing polymerizationunit and an alkoxysilyl-containing polymerization unit.

Description

technical field [0001] This invention relates to a negative photosensitive composition. Moreover, this invention also relates to the manufacturing method of the cured film which used this composition, the cured film formed from this composition, and the element which has this cured film. Background technique [0002] In recent years, in optical elements such as displays, light emitting diodes, and solar cells, various proposals have been made for the purpose of improving light utilization efficiency and saving energy. For example, in terms of liquid crystal displays, the following method is known: by forming a transparent planarization film on a thin film transistor (hereinafter, sometimes referred to as TFT) element, and then forming a pixel electrode on the planarization film, thereby improving the display performance. The aperture ratio of the device (see Patent Document 1). [0003] In addition, a structure in which a touch panel is made on top of an organic EL or liqu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075G03F7/027G03F7/038G03F7/40
CPCG03F7/027G03F7/038G03F7/075G03F7/0757G03F7/0758G03F7/40G03F7/20G03F7/0045G03F7/0382G03F7/30
Inventor 三角元希横山大志谷口克人九泽昌祥
Owner MERCK PATENT GMBH
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