Intelligent adhesion device for manufacturing

An intelligent manufacturing and bonding technology, applied in mechanical equipment, connecting components, material gluing, etc., can solve problems such as easy sputtering and inability to accurately control bonding fluid

Inactive Publication Date: 2018-09-28
FUYANG SHENGDONG INTELLIGENT MFG TECH DEV CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Bonding is a method of firmly connecting the same or different materials together by means of the adhesive force generated by the adhesive on the solid surface. However, in the existing bonding equipment, it is impossible to precisely control the bonding of each extrusion The amount of liquid, and the position of the titration head is generally fixed, so that it is easy to sputter when titrating the adhesive liquid for objects of different thicknesses. For this reason, we propose a bonding equipment for intelligent manufacturing

Method used

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0021] refer to Figure 1-4 , a bonding device for intelligent manufacturing, comprising a fixed plate 1, a fixed frame 3 with a U-shaped structure is welded on the top of the fixed plate 1, a groove is opened in the middle of the top of the fixed plate 1, and a transmission table is arranged inside the groove 2. The top of the fixed frame 3 is equipped with a push rod motor 4 arranged in the vertical direction, and the push rod end of the push rod motor 4 is fixedly connected with a connecting plate 5 arranged in the horizontal direction. The side is welded with a movable plate 6 arranged in the vertical direction, and the movable plate 6 is slidingly connected with...

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Abstract

The invention discloses an intelligent adhesion device for manufacturing. The intelligent adhesion device for manufacturing comprises a fixed plate, a fixed frame of a U-shaped structure is welded tothe top of the fixed plate, a groove is formed in the middle position of the top of the fixed plate, a conveying table is arranged inside the groove, push rod motors arranged in the vertical directionare installed on the top of the fixed frame, and the push rod ends of the push rod motors are fixedly connected with a connection plate arranged in the horizontal direction; and a movable plate arranged in the vertical direction is welded to the side, away from the push rod motors, of the connection plate, the movable plate is in sliding connection with the side wall of the fixed frame, a fixingtank is installed on the side, away from the fixed frame, of the movable plate, and a storage tank is installed on the inner wall of the top of the fixing tank. Under the combined effect of the components, a burette can adapt adhesive objects of different thicknesses, and excessive splash is avoided in the dropwise adding process of adhesive liquid so that waste can be avoided; and meanwhile, thedropwise adding quantity of the adhesive liquid each time can be accurately controlled, and the adhesive liquid can drip quickly to facilitate another dropwise adding.

Description

technical field [0001] The invention relates to the technical field of bonding equipment, in particular to a bonding device for intelligent manufacturing. Background technique [0002] Bonding is a method of firmly connecting the same or different materials together by means of the adhesive force generated by the adhesive on the solid surface. However, in the existing bonding equipment, it is impossible to precisely control the bonding of each extrusion The amount of liquid, and the general position of the titration head is fixed, so that it is easy to sputter when titrating the adhesive liquid for objects of different thicknesses. For this reason, we propose a bonding equipment for intelligent manufacturing. Contents of the invention [0003] The purpose of the present invention is to solve the shortcomings in the prior art, and propose a bonding equipment for intelligent manufacturing. [0004] In order to achieve the above object, the present invention adopts the follo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C11/10F16B11/00
CPCB05C11/1013F16B11/006
Inventor 秦天云
Owner FUYANG SHENGDONG INTELLIGENT MFG TECH DEV CO LTD
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