Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A circuit board production device

A technology for production equipment and circuit boards, which is applied to printed circuits, printed circuit manufacturing, and electrical components. It can solve the problems that irritating gases cannot be dispersed quickly and etching liquid is easy to fly out of the etching box, so as to increase the speed. , the effect of ensuring work safety

Active Publication Date: 2019-06-04
曾广君
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a circuit board production device, which solves the problems in the prior art that the etching solution easily flies out of the etching box when stirring; and the problem that the irritating gas in the etching box cannot be quickly dispersed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A circuit board production device
  • A circuit board production device
  • A circuit board production device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] The present invention will be described in further detail below by means of specific embodiments:

[0036] The reference signs in the drawings of the description include: etching box 1, L-shaped groove 11, annular ring 2, cover plate 21, stirring rod 211, manual rod 2111, connecting rod 22, protrusion 24, rotating plate 3, rotating plate Body 31, rotating shaft 32, torsion spring 321, placement cavity 4, annular groove 5, cavity 51, communication cavity 52, slide plate 521, pull rod 522, elastic layer 6, support plate 61, spring 62, drum 7, rubber layer 71.

[0037] The embodiment is basically as attached figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 Shown:

[0038] The specific implementation process is as follows:

[0039] A circuit board production device, including an etching box 1, and also includes a cover portion for covering the etching box 1, the cover portion includes an annular ring 2 and ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of removing conductive materials by a chemical or electrolytic method, especially to a circuit board production apparatus comprising an etching box and a covering part. The covering part consists of an annular ring and a cover plate arranged at the center of the annular ring; and connecting rods are connected between the cover plate and the annular ringand an exhausting hole is formed between each two adjacent connecting rods. A rotating plate that can cover the exhausting holes is connected between the annular ring and the cover plate in a rotation manner; and a torsion spring is arranged at the rotating plate. A placing part is arranged inside the etching box; an annular slot is formed in the inner wall of the etching box; a cavity is formedin the wall of the etching box; a connection cavity is communicated between the bottom of the annular slot and the cavity; a sliding plate is arranged in the connection cavity in a sliding connectionmanner; a pull rod is fixed at the sliding plate; and a protrusion is fixed at the annular ring. An L-shaped slot is formed in the inner wall of the etching box; and an elastic layer is arranged at the bottom of the L-shaped slot. Therefore, problems that the etching liquid is easy to splash out of the etching box at the stirring time and irritant gas can not be exhausted quickly in the etching box in the prior art can be solved.

Description

technical field [0001] The invention relates to the technical field of removing conductive materials by chemical or electrolytic methods, in particular to a circuit board production device. Background technique [0002] With the development of social economy and the continuous improvement of people's consumption level, the use of electronic equipment is becoming more and more extensive. At this stage, the circuit board in electronic equipment is an extremely important part. Therefore, in order to better control the circuit The surface of the board is processed, and a large number of printed circuit board production and processing devices have appeared in the society. [0003] Usually, the circuit board needs to go through many processes in the manufacturing process before it can be prepared into a finished product. Among them, the etching process of the circuit board is one of the most critical processes in the entire manufacturing process of the circuit board. The main pur...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06
CPCH05K3/068H05K2203/0743
Inventor 许根海
Owner 曾广君
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products