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High-pressure forming shell of 3D composite board and fabrication technology thereof

A high-pressure forming, composite sheet technology, applied in printing process, synthetic resin layered products, printing of special varieties of printed matter, etc., can solve the problems of weak impact resistance, technical limitations, poor toughness, etc., and achieve process stability. The effect of good performance, simple production process and high production efficiency

Pending Publication Date: 2018-09-04
DONGGUAN MEMTECH ELECTRONICS MEMTECH ELECTRONICS PRO
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0002] At present, if conventional injection molding is used for the production of mobile phone back shells, it is difficult to meet the high-required curved surface effect; some also use 3D glass effect production technology, but there is a problem of unstable bonding between UV glue and glass, and its toughness is not good. , resulting in poor impact resistance; in addition, the thickness of the existing mobile phone back shell is difficult to achieve further ultra-thin, technically limited

Method used

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  • High-pressure forming shell of 3D composite board and fabrication technology thereof
  • High-pressure forming shell of 3D composite board and fabrication technology thereof
  • High-pressure forming shell of 3D composite board and fabrication technology thereof

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Embodiment Construction

[0032] Please refer to Figure 1 to Figure 3 As shown, it shows the specific structure of the embodiment of the present invention.

[0033] A 3D composite plate high-pressure formed shell, which is a curved shell 100, which has a transparent PC composite plate base 10, and the transparent PC composite plate base 10 has a first outer surface and a second outer surface arranged on opposite sides, and its The first outer surface is provided with mirror silver ink layer 20, UV transfer glue layer 30, optical coating layer 40, and hardness strengthening liquid layer 50 in sequence, and the second outer surface is provided with first color ink layer and second color ink layer in sequence. The ink layer 70, the second color ink layer 70 is the same color sub-color of the first color ink layer.

[0034] In this embodiment, the first color ink layer includes three first color ink layers arranged on the second outer surface in sequence, that is, the first first color ink layer 61 and t...

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Abstract

The invention discloses a high-pressure forming shell of a 3D composite board and a fabrication technology thereof, comprising the following steps: (1) a material preparing step of preparing a transparent PC composite board; (2) a printing step of orderly performing mirror silver ink printing, UV glue transfer printing and optical coating from inside outwards on one side of the transparent PC composite board, and orderly performing black ink printing and matt black ink printing from inside outwards on one side of the transparent PC composite board; (3) a high-pressure forming step of performing curved surface forming on the plate-shaped semi-finished product obtained in the step (2) by using a high-pressure forming module so as to obtain a curved surface shell; and (4) an enhancing liquidcoating step of coating enhancing liquid on the portion corresponding to the external surface of the optical filming layer on the curved surface shell, so as to strengthen the surface hardness. So that, various texture effects, color requirements and curved surface effects may be realized, the glass hardness is reached and the PC toughness is obtained to tolerate more powerful shocks. Furthermore,the product becomes thinner, the cost is lower, and the production efficiency is higher.

Description

technical field [0001] The invention relates to the technology in the field of manufacturing electronic product casings, in particular to a 3D composite plate high-pressure forming casing and a manufacturing process thereof. Background technique [0002] At present, if conventional injection molding is used for the production of mobile phone back shells, it is difficult to meet the high-required curved surface effect; some also use 3D glass effect production technology, but there is a problem of unstable bonding between UV glue and glass, and its toughness is not good. , resulting in poor impact resistance; in addition, the thickness of the existing mobile phone back shell is difficult to achieve further ultra-thin, and the technology is limited. [0003] Therefore, in the present invention, the applicant has carefully studied a new technical solution to solve the above problems. Contents of the invention [0004] In view of this, the present invention aims at the deficie...

Claims

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Application Information

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IPC IPC(8): H04M1/18B41M3/06B32B27/36B32B27/06B32B33/00B32B1/00B32B3/28
CPCH04M1/185B32B1/00B32B3/28B32B27/06B32B27/365B32B33/00B41M3/06B32B2307/558B32B2307/4023
Inventor 白毅松
Owner DONGGUAN MEMTECH ELECTRONICS MEMTECH ELECTRONICS PRO
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