A flexible packaging structure and packaging method

Abstract

Embodiments of the present invention provide a flexible packaging structure and packaging method to solve the technical problem in the prior art that the uncontrollable overflow of the liquid material in the organic layer leads to a decrease in the packaging effect. The flexible packaging structure includes a first inorganic layer formed in the inner operable area and the outer packaging area, the first inorganic layer in the packaging area forms a continuous step-down area with a height difference between the upper and lower surfaces, and the surface of the continuous step-down area with a height difference between the upper and lower surfaces faces The operable zone is inclined downward. The surface morphology of the first inorganic layer in the encapsulation area is changed, so that the surface of the first inorganic layer in the encapsulation area forms a downward-sloping surface toward the operable area, so that gravity can become a benign force acting on the liquid material of the first organic layer, utilizing The downward-sloping surface makes it difficult for the liquid material of the organic layer to form a small contact angle in the packaging area, effectively avoids a good wetting effect between the liquid material of the organic layer and the first inorganic layer, and further reduces the chance of accidental overflow of the liquid material of the organic layer.

Description

technical field [0001] The invention relates to the technical field of screen packaging, in particular to a flexible packaging structure and packaging method. Background technique [0002] In the TFE (Thin-Film Encapsulation) thin-film packaging process, based on the inorganic-organic-inorganic packaging structure, there is a defect that the organic layer liquid overflows out of the packaging area uncontrollably during the process of the organic layer being coated from a liquid state to a layer state solidified and stable. . figure 1 Shown is a schematic diagram of a double-dam encapsulation structure aimed at the circumferential direction of the organic layer in the prior art. Such as figure 1 As shown, as a structure to solve this defect, the luminescent material layer 02, the cathode layer 03, the first inorganic layer 04, the first organic layer 05 and the second inorganic layer 06 formed sequentially on the substrate 01 together form a display panel The operable area...

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention provides a flexible packaging structure and packaging method to solve the technical problem in the prior art that the uncontrollable overflow of the liquid material in the organic layer causes the packaging effect to decline

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