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Method for loading repaired printed board solder paste of surface mount device

A technology for surface mount devices and printed boards, which is used in printed circuit manufacturing, assembling printed circuits with electrical components, electrical components, etc., to achieve the effect of reducing uncertainty, improving uniformity, and uniform thickness

Active Publication Date: 2018-08-28
10TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The present invention aims at the disadvantages of solder paste loading for reworked printed boards of existing surface mount devices, and provides a solder paste with good operability, excellent quality, high reliability, uniform solder paste, appropriate amount of solder paste, and more convenient soldering. Paste loading method to improve surface mount device rework printed board solder paste loading printability and long-term reliability of electronic equipment

Method used

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  • Method for loading repaired printed board solder paste of surface mount device

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Embodiment Construction

[0019] refer to figure 1 . According to the present invention, the printed board solder paste loading tooling supported on the printed board and formed is passed through the pressing plate 7 with four columns 5 with suction cups and fixed with nuts, and the pressing film plate 8 is screwed on the pressing plate 7 through fastening nuts 9 Above, the spring 6 passes through the spring column 3 and is installed on the pressure plate 7; the steel mesh template 2 is installed on the printed circuit board 1, and is aligned with the pad; the suction cup of the spring column 3 loaded with solder paste is adsorbed on the printed circuit board 1, the suction cup of the column 5 is adsorbed on the stencil template 2; the solder paste 4 is added to the stencil template 2; the pressing plate 7 is pressed, and the spring 6 is compressed, so that the pressing plate 8 on the pressing plate 7 presses the solder paste 4 into the In the mesh hole on the stencil template 2, keep the position of ...

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Abstract

The invention discloses a method for loading repaired printed board solder paste of a surface mount device, which aims to provide a solder paste loading method possessing good operability, excellent quality and high reliability. The method is realized through the following technical scheme: a printed board solder paste loading tool which is formed by supporting two spring stand columns between a printed board and a pressing plate is prepared, a peripheral stand column with a suction cup is used to pass through the pressing plate to suck a steel mesh template on the printed plate; a film pressing plate connected through the pressing plate is fixed above the steel mesh template, and the solder paste is arranged on the steel mesh template; the spring is compressed, so that the pressing film plate on the pressing plate presses the solder paste into meshes in the steel mesh template; the position of the pressing plate is kept, the pressing plate is lifted, and the suction cup drives the steel mesh template to rise, press brushing of solder paste over-reflow soldering is carried out on a printed board PCB bonding pad to form a welding spot, the solder paste is punched through the steel mesh template and is printed on the bonding pad of the welding area element of the printed circuit board; and the bonding pad is connected with the corresponding bonding pad on the printed circuit board PCB to complete the loading of the solder paste.

Description

technical field [0001] The invention relates to a method for reloading solder paste on a printed board for surface mount components that need to be re-welded due to bad soldering in surface mount components, so as to meet the quality requirements for solder paste loading in re-welding of surface mount components. Background technique [0002] There are many types of surface mount devices SMD (Surface Mount Device). The chip pins are J-shaped and bend into the chip. It is difficult to control the flow of solder during soldering. Bent or folded leads, wrong polarity, wrong or skewed solder pin positioning, excessive solder or solder joint bridging or weak soldering, etc. When soldering, use certain tools to accurately place the non-lead surface mount components on the PCB pads that have been printed with solder paste or glued, and then go through wave soldering or reflow soldering to make the components and the circuit board well established. mechanical and electrical connect...

Claims

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Application Information

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IPC IPC(8): H05K3/34H05K3/22
CPCH05K3/225H05K3/341H05K2203/0126
Inventor 赖复尧苏欣
Owner 10TH RES INST OF CETC
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