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Bonding device for increasing brightness of LED lamp module and manufacturing method thereof

A technology of LED lamp module and bonding device, which is applied to lighting devices, gas/waterproof devices, components of lighting devices, etc., can solve the problems of low LED lighting efficiency, large maintenance workload, wasteful power consumption, etc. Achieve the effect of improving brightness, stable product performance and increasing service life

Pending Publication Date: 2018-08-24
广州市联中电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Part of the blue light emitted by the LED substrate is absorbed by the phosphor, and the other part of the blue light is mixed with the yellow light emitted by the phosphor to obtain white light. Although the LED lamp for general lighting is cheap, it will consume electricity in vain due to the thermal effect of the LED lamp. , leading to low light efficiency of LED lights, short life, and heavy maintenance workload

Method used

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  • Bonding device for increasing brightness of LED lamp module and manufacturing method thereof
  • Bonding device for increasing brightness of LED lamp module and manufacturing method thereof
  • Bonding device for increasing brightness of LED lamp module and manufacturing method thereof

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Embodiment Construction

[0018] In order to further understand the features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0019] like Figure 1 to Figure 3 As shown, the bonding device for increasing the luminance of LED lamp modules in the present invention includes an LED lamp cover board 10 and an LED lamp module board 20. The LED lamp module board 20 is attached to the LED lamp cover board 10, and the LED lamp The module board 20 includes an LED lamp printed circuit board 21 and LED light emitting lamps 22. The LED light emitting lamps 22 are arranged on the LED lamp printed circuit board 21 at intervals. The LED lamp printed circuit board 21 is clamped and arranged in the docking groove 11, and the LED lamp cover board 10 is provided with a groove 12 concave downward on the periphery of the docking groove 11, and a s...

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Abstract

The invention discloses a bonding device for increasing the brightness of an LED lamp module and a manufacturing method thereof. The binding device comprises an LED lampshade plate and an LED lamp module plate; the LED lamp module plate comprises an LED lamp printed circuit board and LED light-emitting lamps, wherein the LED light-emitting lamps are arranged on the LED lamp printed circuit board at intervals, a butt-joint groove is concavely formed in one side of the LED lampshade plate, the LED lamp printed circuit board is arranged in the butt joint groove in a clamped mode, a groove is downwards concavely formed in the periphery of the butt joint groove of the LED lampshade plate, and a sealing rubber part is arranged in the groove; an LED lampshade is convexly arranged at the lower side of the other side of the LED lampshade plate, a pouring sealant portion is arranged on the periphery of the inner side of the LED lampshade, the upper side and the lower side of the LED lampshade plate are provided with clamping plates respectively, and the clamping plates are fixed together through a bolt piece. According to the bonding agent, the sealant is poured into the groove through a dispensing machine, so that the LED lampshade plate and the LED lamp printed circuit board are tightly adhered together, and the waterproof effect of a product is improved; and the periphery of the innerside of the LED lampshade is poured into the pouring sealant through the dispensing machine, so that the brightness of the LED light-emitting lamps is effectively improved.

Description

technical field [0001] The invention relates to the technical field of LED lamp lighting equipment, in particular to a bonding device for increasing the brightness of LED lamp modules and a manufacturing method thereof. Background technique [0002] At present, the LED light-emitting diode, which is most used in daily life, is a solid-state semiconductor device that can convert electrical energy into visible light. It can directly convert electricity into light. For general lighting, people need white light sources. Part of the blue light emitted by the LED substrate is absorbed by the phosphor, and the other part of the blue light is mixed with the yellow light emitted by the phosphor to obtain white light. Although the LED lamp for general lighting is cheap, it will consume electricity in vain due to the thermal effect of the LED lamp. , resulting in low luminous efficiency of LED lamps, short life, and heavy maintenance workload. Contents of the invention [0003] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21K9/90F21V31/04F21Y115/10
CPCF21K9/90F21V31/04F21Y2115/10
Inventor 曹爱民彭华山
Owner 广州市联中电子科技有限公司
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